Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces

Pfeifer, Stephanie; Großmann, S.; Freudenberger, Renate; Willing, Heidi; Kappl, H.

doi:10.1109/holm.2012.6336554

Cited by 16 publications

(9 citation statements)

References 13 publications

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“…The crystallized melt had a mix of Al(Cu) and Θ-phase in its composition, while diffusion layer consisted of γ 2 , δ, ζ 2 and η 2 phases. As reported by Braunovic and Alexandrov (1994) and Pfeifer et al (2012), the conductivity of Θ-phase is 12-16 MSm.m −1 (Fig. 7b), so the depth of penetration for the area where Θ-phase is presented is 300-320 µm.…”

Section: Resultsmentioning

confidence: 58%

Investigación sobre fusión de contacto en materiales compuestos laminados Cu/Al

et al. 2016

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ABSTRACT:The study presents investigation of chemical composition, microhardness and electrical conductivity of Cu/Al laminated metal composite after heat treatment at temperatures higher than Cu-Al eutectic melting point. The Cu/Al bimetal was obtained via explosion welding. Chemical composition of the material after heat treatments was identified using EDS analysis. Eddy current testing was applied to investigate electrical conductivity of the composite's components. Strain-hardened zones were identified in the explosion welded composite. The experimental value of electrical conductivity of explosion welded composite was in good coherence with calculated by additivity rule results. Heat treatments resulted in the formation of multiple interlayers which had high microhardness value and had intermetallics in composition. The electrical conductivity of the identified interlayers was significantly lower than of Cu and Al. RESUMEN:Investigación sobre fusión de contacto en materiales compuestos laminados Cu/Al. Se presentan los resultados de composición química, microdureza y conductividad eléctrica obtenidos en materiales compuestos laminados Cu/Al, tratados térmicamente a temperaturas superiores a las del eutéctico Cu -Al. El bimetal Cu/Al fue obtenido por soldadura por explosión. La composición química del material tras los tratamientos térmicos se analizó por medio de análisis EDS (Espectroscopia de Energías Dispersiva de Rayos X). La conductividad eléctrica se midió mediante ensayos con corrientes Eddy. Las zonas endurecidas en el material soldado por explosión fueron identificadas. El valor experimental obtenido de la conductividad eléctrica está en concordancia con el calculado por la regla de las mezclas. Los tratamientos térmicos dan lugar a la formación de múltiples intercaras de alta dureza, compuestos de intermetálicos. La conductividad eléctrica de las intercaras identificadas es significativamente menor que las correspondientes al Cu y al Al.

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Section: Resultsmentioning

confidence: 58%

Investigación sobre fusión de contacto en materiales compuestos laminados Cu/Al

et al. 2016

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“…The interface formed between aluminium and copper consists of a number of intermetallic compounds (up to 13 stable intermetallic phases according to Murray [7]), the formation of which depends on the annealing temperature and duration. The conductivity of these phases is shown to be many times lower than that of the constituent materials [5,6].…”

Section: Introductionmentioning

confidence: 94%

“…Extrusion of aluminium-copper bi-metallic rods is performed in several reduction steps that are combined with annealing to restore the materials' ductility. The annealing; however, leads to enhanced diffusion between constituents and the formation of brittle aluminium-copper intermetallic compounds at the interface [3,4], which affects the composite wire's conductivity [5,6]. The interface formed between aluminium and copper consists of a number of intermetallic compounds (up to 13 stable intermetallic phases according to Murray [7]), the formation of which depends on the annealing temperature and duration.…”

Section: Introductionmentioning

confidence: 99%

Effect of Severe Plastic Deformation on the Conductivity and Strength of Copper-Clad Aluminium Conductors

Lapovok

Dubrovsky

Kosinova

et al. 2019

Metals

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Aluminium rods with different copper sheath thicknesses were processed by severe plastic deformation at room temperature and then annealed, to join the constituent metals and produce a nanocrystalline microstructure. A study of the effects of the deformation parameters, copper cladding thickness and annealing temperature on the electrical conductivity and hardness of the conductors is reported. It is shown that an interface forms between constituents because of intermixing in the course of severe shear deformation under high hydrostatic pressure and diffusion during the subsequent annealing. The effective conductivity of the aluminium copper-clad conductor dropped after deformation, but was recovered during annealing, especially during short annealing at 200 • C, to a level exceeding the theoretically predicted one. In addition, the annealing resulted in increased hardness at the interface and copper sheath.

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“…Recently, Yuan and Weng [20] demonstrated the diffusion stages of the generation energy for each compound and diffusivity. Table 1 explains the main properties and characteristics of four selected compounds, which are taken from [21,22]. Many investigations have focused on the fabricating of a stable Cu/Al joint to overcome the difficulties in joining these two dissimilar metals.…”

Section: Introductionmentioning

confidence: 99%

Properties of Al/Cu Bimetallic Plate Prepared by P/M Technique: Sintering Temperature Effect

Ata

2017

JES. Journal of Engineering Sciences

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The goal of this work was to fabricate an aluminum/copper powder metallurgy bimetal plates at various sintering temperature ranging between 300 o C and 600 o C. Microstructure and properties for sintering specimens were performed to appreciate the effect of sintering temperature on the final Al/Cu bimetal properties. Three intermetallic compounds (IMCs) were detected (Al 2 Cu, Al 4 Cu 9 and AlCu) between Al. and Cu. interface. Cracks were obtained for the specimens that were sintered at 600 o C, lead to weaken and separation of the Al/Cu plates. The maximum strength for bonding was measured for the specimens that were sintered at 500 o C. For the samples which sintered at 500 o C, the lower electrical resistivity was detected where the good sintering was occurred for this specimen.

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Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces

Cited by 16 publications

References 13 publications

Investigación sobre fusión de contacto en materiales compuestos laminados Cu/Al

Investigación sobre fusión de contacto en materiales compuestos laminados Cu/Al

Effect of Severe Plastic Deformation on the Conductivity and Strength of Copper-Clad Aluminium Conductors

Properties of Al/Cu Bimetallic Plate Prepared by P/M Technique: Sintering Temperature Effect

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