Characterization of mechanical and thermal properties of thin Cu foils and wires

Weiß, B.; Gröger, V.; Khatibi, Golta; Kotas, A. Betzwar; Zimprich, P.; Stickler, R.; Zagar, Bernhard G.

doi:10.1016/s0924-4247(01)00877-9

Cited by 77 publications

(51 citation statements)

References 12 publications

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“…The strain was measured by a noncontacting laser speckle extensometer with a gauge length of 15 mm across the solder joint. 25,26 The actual strain of the solder joints was calculated considering the initial thickness of the solder gap. The model solder joints were manufactured from deformed electrolytic copper plates (99.9 wt.%) with a length of 55 mm and a rectangular cross-sectional area (10 · 2 mm).…”

Section: Methodsmentioning

confidence: 99%

“…Because of this material discontinuity, a stress concentration is produced in both the solder/IMC interface and the 26 The experimental data are lower than the upper limit, because of internal voids and cracks, which act as sites for stress and strain concentration. A similar behavior comparable to this increase of UTS was also determined for the yield stress (n).…”

Section: Tensile Response Of Solder Jointsmentioning

confidence: 98%

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Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Zimprich

Saeed

Betzwar-Kotas

et al. 2007

Journal of Elec Materi

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Future reliability and quality control of microelectronics will greatly depend on a detailed understanding of the complex mechanical and thermal properties of miniaturized lead-free solder joints. Therefore, the question of the occurrence of size effects or dimensionally induced constraints, which could change the mechanical properties of solder joints in small dimensions dramatically, has become the focus of investigation. In this study we investigated the influence of decreasing gap size on the tensile, shear, and stress relaxation behavior of solder joints to investigate the occurrence of size effects and dimensionally induced constraints, which could change the mechanical properties of solder joints significantly in micrometer dimensions. Residual stresses might remain in the solder joints during high-temperature dwell in thermomechanical fatigue. Model solder joints (Sn3.5Ag/Cu) of rectangular shape with gap sizes varying between 25 lm and 850 lm were prepared by reflow soldering to achieve near-industrial soldering processing. Scanning electron microscopy was used for analyzing the microstructure and the complex modes of fracture and crack propagation in the solder interconnect. The observed tensile behavior can be interpreted in terms of an existing theory for brazed joints to complement finite-element analysis that is usually used for a description of these phenomena.

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Section: Methodsmentioning

confidence: 99%

Section: Tensile Response Of Solder Jointsmentioning

confidence: 98%

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Zimprich

Saeed

Betzwar-Kotas

et al. 2007

Journal of Elec Materi

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show abstract

“…Similarly to flow stress, fracture strain decreases with the decrease of specimen size [16,17] and the increase of grain size [12]. This phenomenon was found in tensile tests of wire and thin details.…”

Section: Fracturementioning

confidence: 57%

Numerical Simulation in Microforming for Very Small Metal Elements

Mogielnicki¹

2016

Modeling and Simulation in Engineering Sciences

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Microforming is a technology of very small metal elements production, which are required as a parts for many industrial products resulting from microtechnology. This chapter gives a review of the state-of-the-art microforming of metals and its numerical simulations. Phenomena occurring in the miniaturization of microbulk-forming technologies are described. The main problems in microforming are size effects, which have physical and structural sources and directly affect the material flow mechanics in microscale. Size effects must be taken into account in all areas of the forming process chain, demanding new solutions, especially in workpiece structure and die surface numerical modeling.

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“…Yang et al 13) showed that the fatigue life of copper wire decreases with a decrease in their diameter from 50 to 30 µm. Weiss et al 14) and Khatibi et al 15) also obtained similar results in the diameter range of 10 to 125 µm. Similarly, Dai et al 16,17) reported that fatigue resistance of copper foils decreases with a decrease in the foil thickness in the range from 20 to 420 µm.…”

Section: Introductionmentioning

confidence: 54%

Effects of Thickness and Crystallographic Orientation on Fatigue Life of Single-Crystalline Copper Foils

et al. 2015

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Thickness effect on fatigue life of pure copper single-crystal foils with two different surface orientations, ð211Þ and ð5 11 1Þ, but with the same stress-axis orientation was investigated by means of S-N curve measurement and microstructural observation. Thicknesses of the foils were in range from 140 to 500 µm. Fatigue life of the ð21 1Þ specimen was much longer (by a factor of 1000) than that of the ð5 11 1Þ specimen within the given range of the foil thickness. The orientation dependence of fatigue life became more pronounced with decreasing the foil thickness. The size and crystal orientation dependence of the fatigue life can be explained reasonably by considering the reduction of the net area of the primary and secondary slip planes during deformation.

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Characterization of mechanical and thermal properties of thin Cu foils and wires

Cited by 77 publications

References 12 publications

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Numerical Simulation in Microforming for Very Small Metal Elements

Effects of Thickness and Crystallographic Orientation on Fatigue Life of Single-Crystalline Copper Foils

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