Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

State-of-the-Art in Chiplets Horizontal Communications

“…During IEEE/ECTC 2021 and 2022, IBM presented seven papers on "Direct Bonded Heterogeneous Integration (DBHi) Si Bridge" [10][11][12][13][14][15][16] (Fig. 9).…”