Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration

Sato, Kazuo; Shikida, Mitsuhiro; Matsushima, Yoshihiro; Yamashiro, Takashi; Asaumi, Kazuo; Iriye, Yasuroh; Yamamoto, Masahiro

doi:10.1016/s0924-4247(97)01658-0

Cited by 281 publications

(184 citation statements)

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“…The etch rate for {100} faces (i.e. the top of the wafer) is 1-2 orders of magnitude faster than for {111} faces, 8,9 resulting a DPO with beveled {111} edges and a bottom face which extends approximately 212µm beyond the top face along all edges.…”

Section: Annealingmentioning

confidence: 99%

Annealing and Extended Etching Improve a Torsional Resonator for Thin Film Internal Friction Measurements

2018

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We evaluate two methods to improve the background internal friction of the Double Paddle Oscillator (DPO), which has a nominal low temperature value of Q -1 ≈ 2×10-8. We find that annealing the DPO in vacuum at 300°C for 3 hours systematically reduced Q -1 at all temperatures and revealed a 100K internal friction peak by permanently removing it. We also find a striking decrease of low temperature Q -1 as the DPO geometry is altered through extended etching. This decrease is evaluated via Finite Element Method modeling in terms of mode mixing and attachment loss.

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Section: Annealingmentioning

confidence: 99%

Annealing and Extended Etching Improve a Torsional Resonator for Thin Film Internal Friction Measurements

2018

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“…Wet etching in KOH allows for better selectivity of material removal, since the rate of etching of SiN is negligible [38], however, the rate of silicon removal depends upon the crystallographic properties [42,43]. The {111} family has a much smaller etching rate than other faces, and so should be used for the side-walls of the "trench".…”

Section: Fabrication Of a Resonator With Nanoscale Silicon Nitridmentioning

confidence: 99%

“…For the (110) process, the {311} faces are removed more slowly than the others, apart from {111} [42]. Thus, the process is dependent upon the {311} faces.…”

Section: Fabrication Of a Resonator With Nanoscale Silicon Nitridmentioning

confidence: 99%

Towards thermal noise free optomechanics

Page¹,

Zhao²,

Blair³

et al. 2016

J. Phys. D: Appl. Phys.

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Thermal noise generally greatly exceeds quantum noise in optomechanical devices unless the mechanical frequency is very high or the thermodynamic temperature is very low. This paper addresses the design concept for a novel optomechanical device capable of ultrahigh quality factors in the audio frequency band with negligible thermal noise. The proposed system consists of a minimally supported millimeter scale pendulum mounted in a Double End-Mirror Sloshing (DEMS) cavity that is topologically equivalent to a Membrane-in-the-Middle (MIM) cavity. The radiation pressure inside the high-finesse cavity allows for high optical stiffness, cancellation of terms which lead to unwanted negative damping and suppression of quantum radiation pressure noise. We solve for the optical spring dynamics of the system using the Hamiltonian, find the noise spectral density and show that stable optical trapping is possible. We also assess various loss mechanisms, one of the most important being the acceleration loss due to the optical spring. We show that practical devices, starting from a centre-of-mass pendulum frequency of 0.1 Hz, could achieve a maximum quality factor of 10 14 with optical spring stiffened frequency 1-10 kHz. Small resonators of mass 1 µg or less could achieve a Q-factor of 10 11 at a frequency of 100 kHz. Applications for such devices include white light cavities for improvement of gravitational wave detectors, or sensors able to operate near the quantum limit.

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“…In order to easily visualize the anisotropy of an etchant, the etch rates values of the different orientations are assigned to different colors and stereographic representations are coloured accordingly. A thorough characterization of KOH and TMAH etchants was performed by Sato et al by etching silicon hemispheres [188,189]. Nevertheless, another method that consists in etching a silicon structure similar to a wagon wheel was used to characterize KOH [190] and it has recently been proved to obtain accurate characterizations for KOH and TMAH [191].…”

Section: Etch Rate Crystallographic Orientation Dependentmentioning

confidence: 99%

“…Nevertheless, the shape of the resulting structures is difficult to predict due to multiple experimental parameters, such as crystallographic orientations [176,191,276,277], composition of etchant solution (e.g. KOH [188,193] or TMAH [177,278]), its concentration and temperature [191,192], and usage of additives (e.g. Triton [175,195] or IPA [193,194]).…”

Section: Introduction and Drawbacks Of Previous Wet Etching Simulatorsmentioning

confidence: 99%

Study, Modelling and Implementation of the Level Set Method Used in Micromachining Processes

Álvaro¹

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"Sí com lo taur se'n va fuyt pel desert quantés sobrat per son semblant qui·l força, ne torna may fins ha cobrada força per destruir aquell qui l'ha desert: tot enaxí·m cové lunyar de vós, car vostre gest mon esforç ha confús: no tornaré fins del tot haja fus la gran pahor qui·m toll ser delitós." Ausiàs March, 1397 - †1459 Per a Marc AgradecimientosSin duda, todo el trabajo que hay detrás de esta tesis ha sido posible gracias a la colaboración y dedicación de muchos. Todos ellos merecen ser agradecidos por haber contribuido a su manera en la culminación de este trabajo.Agradecer sinceramente a mis directores y tutores, Ximo Cerdà y Ricardo Colom, por permitir formarme como investigador y ofrecerme sus consejos. Ellos me han tratado con respeto y nunca han puesto freno a mis ambiciones, más bien las han engrandecido. Gracias por guiar toda esta aventura.Una mención muy especial se merecen MiguelÁngel Gosálvez y Néstor Ferrando. Les tengo que agradecer la gran suerte que he tenido de poder colaborar con dos eminencias como ellos. Sus grandes conocimientos han permitido obtener los mejores resultados de este trabajo, además de haber sido una experiencia gratificante. Gracias por su constante apoyo y su ayuda infinita.Asimismo, dar las gracias también a Vicente Herrero, Jose María Monzó, Ana Ros y Ramón J. Aliaga. Ellos dieron vida a un ambiente de trabajo idóneo, aportándome mucho más que ayuda y conocimientos. Del mismo modoÁngel Tébar, Rafael Gadea y Jorge Daniel siempre han estado dispuestos a ayudar en todo cuanto han podido.Mi estancia en el instituto Fraunhofer de Erlangen me ha permitido acelerar mi formación y vivir unas experiencias de lo más satisfactorias. Todo ello ha sido gracias a la magnífica gente con la que he tenido el placer de colaborar y convivir. Gracias a Eberhard Bär y a toda la incontable gente del Fraunhofer IISB.Un mérito especial se merecen mi familia y mis amigos por aguantarme todo este tiempo sin perder la paciencia conmigo ni en los peores momentos. Es de un valor incalculable tener tantos hombros en los que poder dejarte caer para coger las fuerzas suficientes para seguir. Gracias Isidor y Lourdes, gracias Ferran y Andreu, y gracias Vicente, Enric y David.iii No podía faltar mi particular aimia, Nuria.Ella se merece un eterno agradecimiento por haber tenido que vivir todo esto conmigo. Compañera de todas y cada una de las experiencias, buenas y malas, de esta larga aventura. Animándome en todo momento, siempre ayudándome con un altruismo deslumbrante y enseñándome una inmensidad de conocimientos. Ella, ha sido y es, mi llir entre cards.Una vez más, muchísimas gracias a todos. iv SummaryThe main topic of the present thesis is the improvement of fabrication processes simulation by means of the Level Set (LS) method. The LS is a mathematical approach used for evolving fronts according to a motion defined by certain laws. The main advantage of this method is that the front is embedded inside a higher dimensional function such that updating this function instead of directly the front it...

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Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration

Cited by 281 publications

References 5 publications

Annealing and Extended Etching Improve a Torsional Resonator for Thin Film Internal Friction Measurements

Annealing and Extended Etching Improve a Torsional Resonator for Thin Film Internal Friction Measurements

Towards thermal noise free optomechanics

Study, Modelling and Implementation of the Level Set Method Used in Micromachining Processes

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