Characterization of p-AlxGa1−xAs/p-GaAs structure studied by surface photovoltage in metal–insulator–semiconductor configuration

Liu, Jian; Fan, Cunzheng; Chen, Xinlong; Jiao, Gangcheng; Hu, Canglu; Qian, Yunsheng

doi:10.1016/j.mssp.2013.12.006

Cited by 4 publications

(1 citation statement)

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“…Among various elements of semiconductor NCs, silicon (Si) NCs are recently investigated intensively because of the high compatibility to the complementary metal-oxide semiconductor (CMOS) technology. 9,[18][19][20][21][22] We have recently developed a colloidal Si NC having heavily boron (B) and phosphorus (P) codoped shells. [23][24][25][26][27][28] The codoped Si NC is dispersible in polar solvents without organic ligands because of a negative electrostatic potential induced on the surface.…”

Section: Methodsmentioning

confidence: 99%

Combined analysis of energy band diagram and equivalent circuit on nanocrystal solid

Kano

Sato

Fujii

2016

Journal of Applied Physics

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We investigate a combined analysis of an energy band diagram and an equivalent circuit on nanocrystal (NC) solids. We prepared a flat silicon-NC solid in order to carry out the analysis. An energy band diagram of a NC solid is determined from DC transport properties. Current-voltage characteristics, photocurrent measurements, and conductive atomic force microscopy images indicate that a tunneling transport through a NC solid is dominant. Impedance spectroscopy gives an equivalent circuit: a series of parallel resistor-capacitors corresponding to NC/metal and NC/NC interfaces. The equivalent circuit also provides an evidence that the NC/NC interface mainly dominates the carrier transport through NC solids. Tunneling barriers inside a NC solid can be taken into account in a combined capacitance. Evaluated circuit parameters coincide with simple geometrical models of capacitances. As a result, impedance spectroscopy is also a useful technique to analyze semiconductor NC solids as well as usual DC transport. The analyses provide indispensable information to implement NC solids into actual electronic devices. Published by AIP Publishing.

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