Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization

Shattuck, Kristin G.; Lin, Jeng‐Yu; Cojocaru, Paula; West, Alan C.

doi:10.1016/j.electacta.2008.05.077

Cited by 26 publications

(18 citation statements)

References 20 publications

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“…Electrochemical polishing (ECP) and electrochemical mechanical planarization (ECMP) have emerged to offer alternative means of planarization, due to their potential improvements in both the reduction of consumables use and the increase in planarization performance compared to current technologies [9][10][11]. However, recent studies have shown that the use of ECP alone will not suffice for future nodes, especially for planarization of low-aspect ratio features [5].…”

Section: Introductionmentioning

confidence: 97%

“…This study is intended to explore the planarization capability of a phosphate based electrolyte containing BTA as an additive, as a validation of a previous ECMP electrolyte screening study [11]. Operating potential and other characteristics of this electrolyte have been previously examined and the optimized set of electrolyte characteristics and operating conditions are used throughout this investigation [11].…”

Section: Introductionmentioning

confidence: 99%

“…As e increases, feature scale planarization increases. Equation 1 was used to predict planarization capabilities of ECMP electrolytes using electrochemical methods on both a custom built bench top ECMP tool, using blanket wafer fragments, and a Cu RDE [11]. The optimized ECMP electrolyte from the previous study is currently being used in this study to focus on the actual planarization of various patterned structures.…”

Section: Introductionmentioning

confidence: 99%

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An investigation of phosphate based ECMP electrolyte performance on feature scale planarization

Shattuck

West

2009

J Appl Electrochem

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Conventional copper chemical mechanical planarization (CMP) techniques are being pushed to their limits by increasing industrial standards caused by device miniaturization and the use of new materials. There is a need to investigate alternative methods of polishing to maintain and/or improve planarization standards while operating at low downforce. In this study, electrochemical mechanical planarization (ECMP) is considered as an alternative and/or an extension to current CMP processes. ECMP is unique due to the combination of an applied voltage to oxidize Cu and an abrasion from a polishing pad, which potentially allows the system to achieve high levels of planarization through the use of an appropriately tailored electrolyte. An electrolyte containing 1.0 M potassium phosphate salt concentration with a pH value of 2 and a benzotriazole (BTA) concentration of 0.001 M was tested for its planarization capability on patterned Cu structures using a custom built ECMP tool. Feature sizes of the Cu structures were varied from 1 to 6 lm. Similar planarization results were achieved using three pad types. All experiments were performed at 0.5 V versus Ag/ AgCl reference. The average step height reduction (SHR) was *840 nm while the decrease in the average metal thickness removed (k avg ) was on the order of *430 nm. Because features were approximately 50% of the substrate area, the total average metal thickness removed was approximately half of the SHR for all three pad types.

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Section: Introductionmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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An investigation of phosphate based ECMP electrolyte performance on feature scale planarization

Shattuck

West

2009

J Appl Electrochem

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“…This was performed in the three electrode setup, using Platinum as counter electrode and a saturated Ag/AgCl reference electrode. A phosphoric acid based bath, described elsewhere, 26 was used to perform electropolishing in potentiostatic conditions.…”

Section: Methodsmentioning

confidence: 99%

Ink-Jet Printing and Electrodeposition for the Production of Free Standing and Polymer Supported Micronet Electrodes

Oriani

Spreafico

Pedroli

et al. 2015

ECS J. Solid State Sci. Technol.

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A study on optimization of Ink-Jet printing parameters, in terms of drop spacing, operative voltage and waveform, metallic line width and spacing is presented, with the aim of producing flexible Transparent Conducting Electrodes (TCEs). Silver micronets were produced by Ink-Jet printing on PET films, to obtain polymer supported transparent electrodes; preliminary studies were also performed on the production of freestanding electrodes, by electrodeposition on the printed micronets. The study reveals that PET supported transparent conductive electrodes can be obtained by ink-jet printing, having improved performances with respect to Indium Tin Oxide (ITO) in terms of resistivity and resistance to bending: no cracking or delamination was observed during bending of the micronets and resistance, measured between two points at 3 cm distance, is one order of magnitude lower for the micronets. Preliminary studies on production of freestanding meshes reveal that this process is promising and allows further reduction in electrode resistance, measured between two points at 3 cm distance, of one order of magnitude. Line width, which is the main limitation of this process, can be conformally reduced by electropolishing without causing collapse of the freestanding micronet. Transparent conductive electrodes (TCEs) are widely used in the growing market of organic and thin film solar cells, liquid crystalline displays and O-LEDs.1-3 A common requirement among these applications is the possibility of producing transparent and conductive electrodes directly on polymeric substrates, which is related to the growing interest in flexible electronics. Indium tin oxide (ITO), the most commonly used material in the display industry, has several limitations when considering the actual needs in this field: it is prone to cracking on flexible substrates, 4,5 it is expensive, due to the presence of Indium, and requires high temperatures during the thin film fabrication process.6 Therefore substitution of ITO is necessary to satisfy the evolution of electronic industry; at the moment attention is mainly focused on conductive polymers, 4,7,8 single-walled carbon nanotubes (SWNTs), 9-11 graphene and metallic nanostructures. 12-15If polymeric transparent electrodes are limited by their intrinsic low conductivity, carbon nanotubes and silver nanowires (AgNW) show promising properties but still need some improvement. Transparent conducting electrodes produced with SWNTs have typical resistance of 200 / at 80% transmission (at a wavelength of 550 nm). 11This resistance value is an order of magnitude higher than that of ITO, therefore it is insufficient for applications in large-area devices. Lower sheet resistance may be obtained with AgNW, due to the intrinsically lower resistivity of silver, but issues are relative to the presence of height variations greater than 100 nm in the deposit. [16][17][18][19] Despite their promising properties as potential replacements for ITO, these materials still suffer from the trade-off between electrical conduc...

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“…Even in [8][9][10] it was shown that on a surface of copper immersed in an acidic or neutral aqueous solution containing MBT, a thin film of complex Cu(I) -MBT = 1:1 is formed. Since phosphate solutions are suggested as media for chemical mechanical planarization of copper in manufacturing integrated circuits [11], the adsorption of MBT on copper surface from these solutions was studied in our lab [12]. It should be noted that according to [13], MBT is very efficient in suppressing the copper oxide formation covering almost completely a copper surface in 800 s. This property of MBT is very important, but it remained unclear whether MBT is capable of preventing the formation of Cu(II) phosphate.…”

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confidence: 99%

New possibilities of metal corrosion inhibition by organic heterocyclic compounds

Kuznetsov

Frumḳin²,

Federation³

2012

Int. J. Corros. Scale Inhib.

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It is shown that many heterocyclic organic compounds, e.g., various azoles, are capable of adsorption on metals with formation of strong bonds with the surface. The approach based on the linear free energy relationship (LFER) principle offers a description of the efficiency of corrosion inhibition by these compounds and provides an understanding of the nature of chemical bonds formed by an organic inhibitor with a metal that needs to be protected. Knowledge of the specifics of interaction between azoles and metal surfaces can be helpful in choosing a promising corrosion inhibitor for drastic conditions, for example, in chemical mechanical planarization slurries where simultaneous mechanical polishing and electrochemical dissolution of the surface usually occur. Corrosion inhibition of steel at high temperatures (≥ 150°C) in mineral acid solutions is yet another example of a new successful use of azoles. It is demonstrated that new possibilities for improving the anticorrosive protection of metals are provided not only by using mixtures of some azoles with carboxylate-type organic corrosion inhibitors but also by constructing bilayer nanocoatings from aqueous solutions. For example, strong adsorption of small amounts of rather an exotic compound, dimegin (disodium salt of deuteroporphyrin), not only promotes the passivation of iron in neutral aqueous solutions but also impedes the local depassivation of the metal. Furthermore, it offers wide possibilities for further improvement of adsorption of other heterocyclic chemical compounds due to preliminary modification of the metal surface even by a small dimegin concentration. Key words: corrosion inhibitors, linear free energy relationship, azoles, adsorption.Received: July 15, 2012July 15, . doi: 10.17675/2305July 15, -6894-2012 One of the most important groups of corrosion inhibitors (hereinafter inhibitors) includes heterocyclic compounds. The interest in these compounds has not abated for over half a century. Meanwhile, over the last decade, not only the specific features of the mechanism have been studied in more detail for known inhibitors of this type, but also the range of objects that can be protected has been expanded and new efficient inhibitors and protection

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Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization

Cited by 26 publications

References 20 publications

An investigation of phosphate based ECMP electrolyte performance on feature scale planarization

An investigation of phosphate based ECMP electrolyte performance on feature scale planarization

Ink-Jet Printing and Electrodeposition for the Production of Free Standing and Polymer Supported Micronet Electrodes

New possibilities of metal corrosion inhibition by organic heterocyclic compounds

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