Characterization of self-propagating exothermic reaction in bimetallic Zr/Al reactive multilayer nanofoil

Sen, Santanu; Babaei, M.; Lake, Markus; Schaaf, Peter; Wiedemann, Martin; Melz, Tobias

doi:10.1515/9783110469240-028

Cited by 1 publication

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“…It is composed of Al and Ni active metal nanofilms formed by magnetic control sputtering as a laminating foil for the combustible material at the bonding interface. This reactive foil can trigger a self-sustaining exothermic reaction by starting heat pulses generated by laser pulses, electric sparks, flames or other methods, to produce a local rapid energy burst (Yupeng et al , 2014; Theodossiadis and Zaeh, 2017; Luo and Zhang, 2021; Sen et al , 2016). It can minimize the problem of thermal mismatch, and thermally sensitive materials/component damage caused by the overall heating (Qiu et al , 2009; Wang et al , 2004; Barmak and Coffey, 2014; Duckham et al , 2006; Fritz et al , 2015; Namazu and Inoue, 2009).…”

Section: Introductionmentioning

confidence: 99%

The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace

Chu,

Chen,

Zhou

et al. 2023

SSMT

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Purpose This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method. Design/methodology/approach Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint. Findings The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3. Originality/value A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

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