Characterization of Spin on Glass Using Thermo Analytical Techniques and Ftir Spectroscopy

Abstract

The curing of a commercial ethoxymethyl-phosphosiloxane at different temperatures and under various gas ambients was characterised using NMR, thermoanalytical techniques, and FTIR spectroscopy. DSC (Differential Scanning Calorimetry) and DTG (Differential Thermo Gravimetry) were employed to characterize the reactions that occur during thermal treatments in O2 or N2 atmospheres. FTIR spectroscopy and CP (Cross Polarization) 133C - NMR were used to detect the presence of the hydroxyl and organic groups in the cured samples. The experimental results identified three different temperatures (400,580,700°C) that define important stages of the curing reaction. In particular, for annealing at temperatuires up to 580°C in 02, DSC, DTG and FTIR spectra showed the elimination of the organic groups. However, when the annealing was carried out in N2 up to 700°C, these groups are retained.

Biodegradable Thin Metal Foils and Spin‐On Glass Materials for Transient Electronics

“…Fourier‐transform infrared spectroscopy (FTIR) reveals the dependence of OH content of the spin‐on glass prepared at three different curing temperatures (Figure e). The stretching modes between 3600 and 3200 cm −1 , which reflect the –OH content, show that the spin‐on glass cured at 300 °C has more –OH than that at 800 °C, demonstrating the tunability of the dissolution rate through control of curing temperatures. Surface topography measurements on SOG materials cured at three different temperatures appear in Figure S5, Supporting Information.…”

“…Spin‐on glass offers attractive properties as an adhesive interlayer in these systems due to its ability to form uniform, conformal coatings . Established use in conventional electronics and an ability to select its properties by appropriate chemical design further motivate the use of such materials for encapsulants and dielectric layers.…”

“…SOG cured at 300 °C dissolves faster (≈50 nm day −1 ) than that cured at 800 °C (≈6 nm day −1 ) at nitrogen environment. The curing reaction is based on high‐temperature condensation between Si(OH) 4 molecules to yield H 2 O and Si–O–Si bonds, with a resulting volumetric shrinkage as described in Figure S4, Supporting Information . The extent of this reaction varies depending on the curing temperature and time; the unreacted parts remain as Si–OH .…”

“…The curing reaction is based on high‐temperature condensation between Si(OH) 4 molecules to yield H 2 O and Si–O–Si bonds, with a resulting volumetric shrinkage as described in Figure S4, Supporting Information . The extent of this reaction varies depending on the curing temperature and time; the unreacted parts remain as Si–OH . Consequently, spin‐on glass cured at lower temperature (300 °C) has highest Si–OH content and fastest rates of hydrolysis than those cured at higher temperatures (400 and 800 °C).…”

“…The extent of this reaction varies depending on the curing temperature and time; the unreacted parts remain as Si–OH . Consequently, spin‐on glass cured at lower temperature (300 °C) has highest Si–OH content and fastest rates of hydrolysis than those cured at higher temperatures (400 and 800 °C). Fourier‐transform infrared spectroscopy (FTIR) reveals the dependence of OH content of the spin‐on glass prepared at three different curing temperatures (Figure e).…”