Characterization of ternary (Ni,Co,Mn)3O4 thin films for microbolometer applications

Le, Duc Thang; Jeon, Chang Jun; Lee, Kui Woong; Jeong, Young Hun; Yun, Ji Sun; Yoon, Dae Ho; Cho, Jeong Ho

doi:10.1016/j.jallcom.2015.07.236

Cited by 13 publications

(12 citation statements)

References 29 publications

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“…The detailed information of the grain size of the annealed films is listed in Table 1. In addition, Figure 3(a-c) indicates an increase in grain size with respect to the Cu adding, similar to the case of the Comodified (Ni,Mn) 3 O 4 films [20]. As the grain was enlarged, the film surface became rougher.…”

Section: Microstructure and Crystal Structure Of Films Annealed At 400 °Csupporting

confidence: 60%

“…The best value, 200 Ω cm, achieved when x = 0.025 was far lower than 6,300 Ωcm for the Cu-free sample, demonstrating an improved conductivity for the films. Furthermore, the specific resistivity value (200 Ω cm) corresponds to the Cu substitution of only 2.5 mol%, was much lower than those of the nickel-manganite films (ρ > 600 Ωcm), modified with 6.5 ~ 8.2 mol% Co, via the same route [20]. This result gave the evidence of stronger effects of the copper substitution on the conductive behavior of nickel-manganite films, when compared to that of cobalt.…”

Section: Electrical Propertiesmentioning

confidence: 83%

“…Second, for the films grown using the Mn 2+ matrix, the pH gap between Mn 2+ and another cation, dominated the possibility of their incorporation: the smaller the pH gap was, the easier it was for film formation. Due to the similar concentration-pH characteristics of the three cations, i.e., Mn 2+ , Ni 2+ and Co 2+ , as shown in Figure 1(b), the cobalt (II) ions were chosen to modify the (Ni,Mn) 3 O 4 compound in our previous work [20]. In contrast, the large pH gap evident between Cu 2+ and Mn 2+ , implied that the substitution of Mn 2+ by Cu 2+ is relatively more difficult than by Ni 2+ and/or Co 2+ .…”

Section: Precursor Solution Preparationmentioning

confidence: 99%

“…The second one was due to the preexisting Mn 3+ ions in the as-grown state; no more oxidizing reactions of Mn 2+ → Mn 3+ were needed in the solid state through annealing. Therefore, the heat treatment played a major role as a driving force only for the rearrangement of ions into the lattices for crystallization, which required a relatively low thermal energy (thus low annealing temperatures) [20].…”

Section: Microstructure and Crystal Structure Of Films Annealed At 400 °Cmentioning

confidence: 99%

“…In the previous publication [19], we demonstrated the synthesis of tetragonal nickel-manganite spinels by LFD from Ni 2+ and Mn 2+ cations with a chloride solution. This technique was then extended for fabricating (Ni,Co,Mn) 3 O 4 cubic spinel-type oxide, yielding highly conductive thin films at a modest annealing temperature of 400° C [20]. The advantage arose the fact that the LFD allowed the Mn 3+ cations to be easily formed (from Mn 2+ ) in the liquid solution, before being absorbed into the films during deposition.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures

Cho

2020

Journal of Asian Ceramic Societies

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Negative-temperature coefficient of resistance (NTCR) thin films were prepared from (Ni 0.2 Mn 2.8-x Cu x )Cl 2 (0.010 ≤ x ≤ 0.040) solutions by liquid flow deposition (LFD) method. Influence of the Cu on the structural and electrical properties of the films annealed at °400°C was studied. It was found that the incorporation of copper (Cu) promoted an increase in both the crystallinity and grain size of the films. As Cu level increased, the absolute negative temperature coefficient of resistance (TCR) of the films was slightly decreased from 3.21% to 2.38%K −1 . On the other hand, the electrical resistivity (ρ) of the films significantly dropped with an increase of Cu, which was attributed to the improved carrier concentration rather than the enlarged grain size. The best electrical performance with ρ ~ 200 Ωcm was achieved in the film with x = 0.025 at room temperature. We provide the discussion on the conduction mechanism, particularly, for the high conduction behavior of the films via the changes of oxidation states of the manganese.

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Section: Microstructure and Crystal Structure Of Films Annealed At 400 °Csupporting

confidence: 60%

Section: Electrical Propertiesmentioning

confidence: 83%

Section: Precursor Solution Preparationmentioning

confidence: 99%

Section: Microstructure and Crystal Structure Of Films Annealed At 400 °Cmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures

Cho

2020

Journal of Asian Ceramic Societies

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Sensitive Wearable Temperature Sensor with Seamless Monolithic Integration

et al. 2019

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Accurate temperature field measurement provides critical information in many scientific problems. Herein, a new paradigm for highly sensitive, flexible, negative temperature coefficient (NTC) thermistor‐based artificial skin is reported, with the highest temperature sensing ability reported to date among previously reported NTC thermistors. This artificial skin is achieved through the development of a novel monolithic laser‐induced reductive sintering scheme and unique monolithic structures. The unique seamless monolithic structure simultaneously integrates two different components (a metal electrode and metal oxide sensing channel) from the same material at ambient pressure, which cannot be achieved by conventional heterogeneous integration through multiple, complex steps of photolithography or vacuum deposition. In addition to superior performance, electronic skin with high temperature sensitivity can be fabricated on heat‐sensitive polymer substrates due to the low‐temperature requirements of the process. As a proof of concept, temperature‐sensitive artificial skin is tested with conformally attachable physiological temperature sensor arrays in the measurement of the temperatures of exhaled breath for the early detection of pathogenic progression in the respiratory system. The proposed highly sensitive flexible temperature sensor and monolithic selective laser reductive sintering are expected to greatly contribute to the development of essential components in various emerging research fields, including soft robotics and healthcare systems.

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A Metal Nanoparticle Thermistor with the Beta Value of 10 000 K

Zhao

Guo

Wang

et al. 2022

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NTC thermistor, metallic oxide powders are mixed with a binder and sintered under high temperature (T ≈400-1450 °C). This step is not energy efficient and, even worse, prevents its use in fields requiring low-temperature processing, e.g., a flexible thermistor. In addition, with the increasing demand for high sensitivity, further improving the performance of ceramic thermistors faces great challenges. Composites of conductive filler in the insulating matrix have been used to improve the sensitivity of the temperature sensor, because the conducting pathways can be disconnected/connected upon swelling/shrinking. However, the temperature window is really small since it has to work near the melting point of crystalline regions. [1] Inspired by the ultrasensitive temperature/heat perception of living creatures, ion-conductive materials have recently attracted considerable attention. [2] For example, a composite of plant cells and carbon nanotubes shows a record high temperature sensitivity due to the increase of "free" conducting calcium cation concentration upon heating. [2b] Various ionic conductive materials (hydrogel, [3] ionic liquid, [2c,4] iongel, [5] etc.) combined with different output modes (resistance, [5a,6] capacitance, [7] voltage, [8] etc.) enable these devices with not only high thermal sensitivity, but also multiple functionalities (flexible, [5b,9] stretchable, [6b,7a] self-healing, [3a,10] etc.), displaying potential applications in electronic skins, prostheses, robots, etc. However, these ionic devices usually require sophisticated fabrication procedures and many of them suffer from poor stability due to the involvement of solvent. Up to now, the widely used NTC thermistor based on these ion-conductive materials with ultra-high sensitivity has been scarcely demonstrated.Metal nanoparticles, because of their physical and chemical attributes, have long been used as elements for sensing various physical (pressure, [11] humidity, [12] temperature, [13] etc.), chemical (organic vapors, [14] metal cations, [15] anions, [16] etc.), and biological (oligonucleotides, [17] proteins, [18] cells, [19] etc.) signals and/or species. Compared with other sensing applications, detecting temperature with metal nanoparticles is usually less efficient. This is due to the measured low activation energy (≈tens of meV), [20] indicating insensitive of their conductance to temperature. It is feasible to adjust the temperature coefficient and sensitivity of metal nanoparticles by various ligand treatments. [21] This method shows a limited increase of the activation energy (100-200 meV) by just tuning the interparticle distance. However, when these nanoparticles are functionalizedThe thermistor, typically made from metallic oxides, is a type of resistor whose electrical resistance is dependent on its temperature. Despite the wide usage, the limitations of ceramic thermistors become increasingly apparent as devices with improved performances are sought and as new applications emerge. Herein, a thermistor that is s...

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Characterization of ternary (Ni,Co,Mn)3O4 thin films for microbolometer applications

Cited by 13 publications

References 29 publications

Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures

Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures

Sensitive Wearable Temperature Sensor with Seamless Monolithic Integration

A Metal Nanoparticle Thermistor with the Beta Value of 10 000 K

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Characterization of ternary (Ni,Co,Mn)3O4 thin films for microbolometer applications

Cited by 13 publications

References 29 publications

Characterization of Cu-doped (Ni,Mn)3O4 thin films annealed at low temperatures

Characterization of Cu-doped (Ni,Mn)3O4 thin films annealed at low temperatures

Sensitive Wearable Temperature Sensor with Seamless Monolithic Integration

A Metal Nanoparticle Thermistor with the Beta Value of 10 000 K

Contact Info

Product

Resources

About

Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures

Characterization of Cu-doped (Ni,Mn)₃O₄ thin films annealed at low temperatures