Characterization of the dynamics of encapsulated silicon MEMS devices using low-coherence heterodyne LDV technology

Wolfer, Marco; Giesen, Moritz; Heilig, Markus; Seyfried, V.; Winter, Marcus

doi:10.1016/j.mne.2023.100191

Cited by 2 publications

(2 citation statements)

References 16 publications

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“…Then, 50:50 BS1 splits the reference beam into beam1 and beam2 on average. (6) Beam1 and echo3 are combined by 50:50 BS2 from different directions. Then, two beams propagate to PBS3 together and produce two interference signals I1 and I2 which are received by PD1 (photodetector) and PD2 respectively.…”

Section: Measurement Principlesmentioning

confidence: 99%

“…It is an alternative to the conventional contacting vibration sensors. With the advantages of wide frequency response and high spatial resolution [1], LDV has been widely used in acoustics [2], automobile manufacturing [3], aerospace [4], quality inspection [5], and MEMS systems [6]. However, speckle noise caused by the laser speckle effect is the dominant factor limiting the development of LDV.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Suppression of speckle noise in laser Doppler vibrometry by signal diversity and dynamic ellipse fitting

Huang,

Chen,

2024

International Conference on Optical and Photonic Engineering (icOPEN 2023)

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Section: Measurement Principlesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Suppression of speckle noise in laser Doppler vibrometry by signal diversity and dynamic ellipse fitting

Huang,

Chen,

2024

International Conference on Optical and Photonic Engineering (icOPEN 2023)

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An Optical Method for Evaluating the Mechanical Properties of Wires Under Impact Tensile Load

Youplao,

Nasbey,

Takita

et al. 2024

IEEE Trans. Instrum. Meas.

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The dynamic properties of materials utilized in architecture or engineering applications can significantly affect their performance under dynamic or impact loading conditions. To evaluate such behavior, force transducers are commonly employed in testing. However, the calibration of force transducers is typically limited to static conditions and relies solely on gravitational forces exerted on standard masses. Thus, assessing the uncertainty in force measurements using force transducers during dynamic loading conditions remains a challenging task, presenting a significant obstacle in accurately characterizing the dynamic behavior of materials. In this work, an optical technique to evaluate the mechanical properties of wires subjected to impact tensile loads is presented. The wire under test is subjected to an impact tensile load by applying the inertial force of a rigid mass, which is supported by utilizing an aerostatic linear bearing with sufficiently small friction. The inertial force applied to the wire can be determined by multiplying the mass of the rigid mass by its acceleration, where the acceleration can be measured employing a Michelson type optical interferometer. The performance of the proposed method is demonstrated through experiments and analysis of the dynamic characteristics of a tungsten wire under impact tensile loading conditions.

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Characterization of the dynamics of encapsulated silicon MEMS devices using low-coherence heterodyne LDV technology

Cited by 2 publications

References 16 publications

Suppression of speckle noise in laser Doppler vibrometry by signal diversity and dynamic ellipse fitting

Suppression of speckle noise in laser Doppler vibrometry by signal diversity and dynamic ellipse fitting

An Optical Method for Evaluating the Mechanical Properties of Wires Under Impact Tensile Load

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