2018
DOI: 10.1016/j.wasman.2018.02.010
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Characterization of the non-metal fraction of the processed waste printed circuit boards

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Cited by 77 publications
(29 citation statements)
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“…Various kinds of metals, such Al, Cu, and Sn, and the precious metals gold (Au), silver (Ag), platinum (Pt), and palladium (Pd) [33][34][35][36] are used in PCBs for electrical conduction. PCBs have a complex composition consisting of a polymer (epoxy resin or fiberglass-based) component, various metals, and ceramic materials [37]. Plastic materials from PCBs contain fire-retardant substances for fireproofing the board.…”
Section: Introductionmentioning
confidence: 99%
“…Various kinds of metals, such Al, Cu, and Sn, and the precious metals gold (Au), silver (Ag), platinum (Pt), and palladium (Pd) [33][34][35][36] are used in PCBs for electrical conduction. PCBs have a complex composition consisting of a polymer (epoxy resin or fiberglass-based) component, various metals, and ceramic materials [37]. Plastic materials from PCBs contain fire-retardant substances for fireproofing the board.…”
Section: Introductionmentioning
confidence: 99%
“…It indicates that WPCBP could significantly reduce the corresponding energy barrier and improve the efficiency to accelerate crosslinking reaction. WPCBP are mainly composed of epoxy resin and glass fiber, and also contains a small amount of residual metal oxide such as CuO, MgO, CaO, ZnO, Fe 2 O 3 , and additives of epoxy resin such as curing agent . It is reported that inorganic metal derivatives (eg, ZnO, MgO, CaO) are suitable as curing activators in SBR compounds to form adducts with accelerator molecules and to further improve their curing efficiency .…”
Section: Resultsmentioning
confidence: 99%
“…Furthermore, the FR-4 substrate is used where flame retardants are required. In general, the NMF of PCB consists of 65 wt% of glass fibers, 32 wt% epoxy resin, and < 3 wt% of impurities (Kumar et al 2018 ).…”
Section: Methodsmentioning
confidence: 99%