Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Sampurno, Yasa; Borucki, L.; Zhuang, Yun; Misra, Sudhanshu; Holland, Karey; Boning, Duane S.; Philipossian, Ara

doi:10.1016/j.tsf.2008.09.077

Cited by 25 publications

(20 citation statements)

References 8 publications

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“…In addition, Sampurno et al also indicated that a ''rough'' pad surface (i.e. a pad surface that had machine marks and burrs as a result of an intentionally non-optimized pad grooving process) increased the variance of shear force [13]. It is believed that such intercorrelations among pad break-in time, mean removal rate, pad roughness and variance of shear force are reasonably consistent with the trends observed in this study.…”

Section: Resultssupporting

confidence: 87%

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Feasibility of a Real-Time Method in Determine the Extent of Pad Break-In During Copper Chemical Mechanical Planarization

2016

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Material removal rate, shear force and variance of shear force during copper polishing are studied as a function of pad break-in time. Results show that copper removal rate and variance of shear force increase within 30 min of pad break-in. Spectral analysis of raw shear force data is employed to help elucidate the fundamental physical phenomena during copper chemical mechanical planarization. Fast Fourier transform is performed to convert the shear force data from time domain to frequency domain. The energy distribution of copper polishing is quantified which sheds light on the effect of pad break-in time. Spectral analysis indicates that as pad break-in progresses, newly formed pad asperities dominate the interaction with the wafer and therefore shifting the spectral amplitudes to the higher frequency peaks (i.e. 101-108 Hz). Further spectral analysis also confirms that such increases in the high-frequency range dominate the distribution of energies. This study shows that a combination of unique spectral fingerprinting and analysis of force variance can be used to monitor the progress of pad break-in in real-time. This work underscores the importance of real-time detection and non-destructive method in chemical mechanical planarization process to quantify the extent of pad break-in.

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Section: Resultssupporting

confidence: 87%

“…In a separate work, Sampurno et al [13] reported that variance of shear force correlated well with the extent of vibration during CMP. In addition, Sampurno et al also indicated that a ''rough'' pad surface (i.e.…”

Section: Resultsmentioning

confidence: 93%

Feasibility of a Real-Time Method in Determine the Extent of Pad Break-In During Copper Chemical Mechanical Planarization

2016

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“…Esses polímeros são geralmente preparados via processamento de pré-polímero, uma vez que possibilita um melhor controle da reação química antes da etapa de reticulação, empregando-se proporções molares da ordem de 1,00 mol de diol para 1,60-2,25 mols de isocianato [2,3] . Os poliuretanos termorrígidos elastoméricos com excelentes propriedades de resistência ao desgaste são utilizados nas indústrias de mineração, óleo e gás, apresentando grandes vantagens financeiras, sendo utilizados na fabricação de peças estruturais de alto desempenho tais como esteiras de mineração, laminados de interior de aviões ou peças de recepção de grandes tubulações em alto mar (enrijecedores de curvatura) [5,6] . Os nanotubos de carbono (CNTs) são considerados como um dos materiais mais resistentes já sintetizados pelo homem.…”

Section: Introductionunclassified

Otimização do processo de dispersão de nanotubos de carbono em poliuretano termorrígido

et al. 2016

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ResumoNeste trabalho foi desenvolvido um processo empregando misturador de alto cisalhamento e moinho de rolos para dispersar MWCNTs (multiwalled carbon nanotubes) puros e modificados em poliol visando a preparação de concentrados de 3% em massa. Condições otimizadas no trabalho permitiram a obtenção de suspensões com menor número e tamanho de agregados de MWCNTs. Compósitos contendo 0,5% em massa de MWCNTs foram preparados por diluição dos concentrados em poliol usando mistura mecânica seguida de cura. Resultados de microscopia indicaram que as melhores dispersões foram obtidas com os MWCNTs modificados, os quais permitiram um aumento na tensão na ruptura, no alongamento e uma melhor preservação da estabilidade térmica. Além disso, valores de condutividade elétrica sugerem que o compósito possa ser empregado para dissipação eletrostática. Dessa forma, os resultados obtidos demonstram que a modificação covalente da superfície dos MWCNTs e a utilização de estratégias eficientes de dispersão são essenciais para melhorar as propriedades finais dos nanocompósitos. Palavras-chave: dispersão de nanotubos de carbono, nanotubos de carbono modificados, propriedades mecânicas, poliuretano termorrígido elastomérico. AbstractA process employing high shear mixer and roll mill to disperse pristine and modified MWCNTs (multiwalled carbon nanotubes) in polyol was developed in order to prepare 3 wt% masterbatches. The optimum process conditions resulted in suspensions with smaller number and size of nanotube aggregates. Composites containing 0.5 wt% of MWCNTs were prepared by dilution of polyol masterbatches by simple mechanical mixing followed by cure. Microscopy data revealed better dispersion of modified carbon nanotubes in the polymer matrix, which promoted an increase in the tensile strength, elongation and a better preservation of thermal stability. Furthermore, electric conductivity values indicated that the composites can be used for electrostatic dissipation. These results demonstrate that the covalent modification of MWCNTs surface and the use of efficient dispersion strategies are essential to improve nanocomposites' final properties.

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“…11,12 Compared with the thermoset IC1000 pad, the thermoplastic polyurethane associated with the D100 pad has linear chain structures that make the pad more elastic and ductile. 13 Consequently, it is more difficult for the diamonds to cut into the D100 pad surface and then fracture and remove pad material during pad conditioning, leading to lower pad wear rates for the D100 pad. Figure 4 compares the pad wear rate on the IC1000 and D100 pads at different platen temperatures using the PEEK-1 retaining ring.…”

Section: Methodsmentioning

confidence: 99%

Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization

Jiao

Zhuang

Wei

et al. 2012

ECS J. Solid State Sci. Technol.

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In this study, pad wear during interlayer dielectric (ILD) chemical mechanical planarization (CMP) was investigated using retaining rings with different materials and slot designs as well as pads with different materials at different platen temperatures. Results showed that the retaining ring slot design did not significantly affect the pad wear rate. On the other hand, the polyether ether ketone (PEEK) retaining ring exhibited a significantly lower pad wear rate (by 31%) than the polyphenylene sulfide (PPS) retaining ring. At both platen temperatures (25 and 50 • C), the thermoplastic D100 pad exhibited lower pad wear rates than the thermoset IC1000 pad.Chemical mechanical planarization (CMP) has been widely used in the semiconductor industry to provide both local and global planarity through the synergism between chemical and mechanical actions. During a CMP process, a slurry containing abrasive particles is injected onto a polishing pad. A wafer securely held by a retaining ring is pressed down and rotated against the pad under an applied pressure. Before polishing, the pad has a rough surface with protruding asperities. As these asperities make contacts with the slurry abrasives as well as the wafer and retaining ring surfaces during polishing, they collapse after the mechanical contacts. To regenerate pad asperities and prevent material removal rate decay, a disk embedded with diamonds is typically used to condition the pad surface under an applied down force. As the disk rotates and sweeps across the pad, the embedded diamonds plow and cut into the pad surface reviving the collapsed pad asperities. In summary, pad conditioning, as well as direct contacts among pad surface, slurry abrasives, wafer and retaining ring surfaces result in pad wear. Pad wear not only reduces pad life, but also generates negative effects on polishing performance. 1-4 While the effects of pad conditioning and slurry abrasives on pad wear have been extensively investigated, 5-8 to date, no study has been published to illustrate how retaining ring material and slot design impact pad wear rate. In this study, retaining rings made of polyether ether ketone (PEEK) and polyphenylene sulfide (PPS) with two different slot designs were polished for 6 hours and their pad wear rates were compared. In addition, tests were performed on different pads at different platen temperatures to demonstrate their effects on the pad wear rate. ExperimentalAll pad wear tests were performed on an Araca APD-800 polisher and tribometer. The polisher and its accessories were described in detail elsewhere. 9 Three retaining rings with two different materials and two slot designs manufactured by Entegris, Inc. were used in this study. These retaining rings were designed for 300 mm wafer CMP processes. The first retaining ring made of PEEK with slot design-1 was referred to as the PEEK-1 retaining ring, the second retaining ring made of PEEK with slot design-2 was referred to as the PEEK-2 retaining ring, and the third retaining ring made of PPS with slot design-...

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Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Cited by 25 publications

References 8 publications

Feasibility of a Real-Time Method in Determine the Extent of Pad Break-In During Copper Chemical Mechanical Planarization

Feasibility of a Real-Time Method in Determine the Extent of Pad Break-In During Copper Chemical Mechanical Planarization

Otimização do processo de dispersão de nanotubos de carbono em poliuretano termorrígido

Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization

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