“…31,32 It is furthermore known that Sn segregates to the surface of Sn-doped In 2 O 3 , 33 and that metallic Sn-In in ITO can be formed after heat treatment, 34 as well as upon electron beam evaporation. 31,35,36 In the case of e-beam deposition, the amount of metallic In present in the amorphous as-deposited film decreases with increasing the incident angle of the ITO vapour to the Si substrate, with increasing the deposition temperature and/or the post deposition annealing temperature, as well as with reducing the deposition rate. 35,36 In a number of studies, the Si-ITO interface has been studied experimentally; see Refs.…”