Characterization of Thin Films

Ohring, Milton

doi:10.1016/b978-0-08-051118-4.50012-8

Cited by 1,000 publications

(1,286 citation statements)

References 5 publications

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“…The deposition method of a thin film can greatly affect the material properties of the layer [10]. The top ARROW layer needs to be deposited at a relatively low temperature (<300°C) in order to protect the device from damage during deposition.…”

Section: Deposit Top Arrow Layersmentioning

confidence: 99%

“…These include PECVD, sputter deposition, and spin-on deposition using a spin-on-glass (SOG). Theoretically, sputter deposition should yield a dense and conformal SiO2 film [10]; however, sputtered SiO2 tends to show structural failure during the sacrificial core etch. Spin-on glass deposition also failed to produce layers that could withstand the sacrificial core etch, leaving PECVD as our only viable deposition method.…”

Section: Deposit Top Arrow Layersmentioning

confidence: 99%

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Materials and microfabrication processes for ARROW-based optofluidic biosensors

Wall

Parks

Schmidt

et al. 2015

2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)

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Abstract-This paper outlines the microfabrication processes and materials used to make an optofluidic lab-on-a-chip biosensor that detects individual biological particles. The biosensor uses a hollow-core ARROW waveguide with a low refractive index liquid core and is fabricated on a silicon wafer using a combination of PECVD deposition, RIE etching, and standard photolithographic processes. As a sensing example, detection of fluorescence signals emitted by labeled oligonucleotides inside the liquid core was used to illustrate the chip's potential to identify protein-coding regions of the Zaire Ebola virus genome.

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Section: Deposit Top Arrow Layersmentioning

confidence: 99%

Section: Deposit Top Arrow Layersmentioning

confidence: 99%

Materials and microfabrication processes for ARROW-based optofluidic biosensors

Wall

Parks

Schmidt

et al. 2015

2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS)

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“…The radius of curvature was deduced from the bow and used to calculate the stress of the Pyrex chip bonded on the metallic plate according to the following formula [13]:…”

Section: Thermal Stressmentioning

confidence: 99%

Bonding properties of metals anodically bonded to glass

Briand

Weber

Rooij

2004

Sensors and Actuators A: Physical

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Anodically bonded Pyrex-/Metal double stack were investigated for applications in the sensor encapsulation field. The use of metals can increase the robustness of the packaging and eliminate the use of glue. Titanium anodically bonded to glass can lead to biocompatible systems The anodic bonding of metallic sheets of Invar, Kovar, Alloy 42 and titanium to ion-containing glasses, Pyrex and Foturan, was evaluated in terms of samples preparation, bonding parameters, and bonding characteristics. At a bonding temperature below 300 • C, the stress induced to Pyrex was smaller when the Invar was used, however, a weak bonding was obtained at the lowest bonding temperatures investigated. In comparison with Invar and Alloy 42 bonded to Pyrex, Kovar induced a smaller stress for bonding temperatures higher than 350 • C. For bonding temperatures in between 300 and 350 • C, a similar value of stress was obtained for Kovar and Alloy 42 bonded to Pyrex as well as a high bonding strength. A post-annealing step at a temperature of and higher than the bonding temperature was shown to decrease the bonding stress and can be used to improve the bonding strength of samples bonded at low temperature. Kovar and Alloy 42 bonded to Pyrex at temperatures of and higher than 250 • C were tight to liquid at a pressure of 1.5 bars. In the case of titanium, Pyrex and Foturan were successfully bonded to titanium thin films and sheets, respectively. A proper selection of metals and bonding parameters led to levels of residual stress, strength and tightness that make anodic bonding of metals to glass a suitable technique for the assembling and packaging of microsystems, for instance piezoresistive silicon sensors and microfluidic devices.

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“…It is well known that above mentioned properties depend on thin films deposition method and growth conditions [9]. Currently, the magnetron sputtering [10] and chemical methods, namely chemical bath [11e13], photochemical [14], and electrochemical deposition [15,16] etc., are the most used techniques for growth of CdSe films.…”

Section: Introductionmentioning

confidence: 99%

Morphological, structural, compositional properties and IR-spectroscopy of CdSe films deposited by close-spaced vacuum sublimation

Ivashchenko

Opanasyuk

Perekrestov

et al. 2015

Vacuum

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a b s t r a c tThe polycrystalline CdSe films were deposited by the close-spaced vacuum sublimation technique at the different substrate temperatures (373e873 K). Surface morphology, grain size and growth mechanism of the films were determined by the scanning electron microscopy. The X-ray diffraction analysis of structural and sub-structural properties of the films was carried out to study their phase composition and growth texture. The main structural parameters of thin films, such as texture, lattice parameter, grain size, scattering domain size and micro-stress level have been determined in the work depending on the condensation film conditions. RBS and FTIR analysis shows that obtained films in general are homogenous and pure. As a result, the growth conditions of CdSe polycrystalline films with good crystal quality were determined.

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Characterization of Thin Films

Cited by 1,000 publications

References 5 publications

Materials and microfabrication processes for ARROW-based optofluidic biosensors

Materials and microfabrication processes for ARROW-based optofluidic biosensors

Bonding properties of metals anodically bonded to glass

Morphological, structural, compositional properties and IR-spectroscopy of CdSe films deposited by close-spaced vacuum sublimation

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