Characterizations of poly(ester imide) nanocomposites containing organically modified hectorite

Monomer Dependence of Colorless and Transparent Polyimide Films: Thermomechanical Properties, Optical Transparency, and Solubility

“…As CPI is mostly an amorphous polymer, the melt transition temperature cannot be observed using differential scanning calorimetry (DSC), and the thermal properties of CPI are mainly explained by the glass transition temperature ( T g ). The T g not only varies depending on the structure of the monomers that make up the polymer but is also affected by the type of substituent, free volume due to chain movement, secondary bonds such as hydrogen bonds within the main chain, and curing reaction. , In the case of composite materials, the T g is directly affected by dispersed fillers. − Additionally, the T g is affected by the stiffness and flexibility of the polymer chains and is thus greatly affected by the degree of chain interaction and segmental motion resulting from free volume changes Table summarizes the T g values of CPIs composed of various monomers.…”

Effect of organoclay on the physical properties of colorless and transparent copoly(amide imide) nanocomposites

“…Many attempts to introduce functional groups such as esters, ethers, amides, and sulfones into the main chain to improve the low solubility and processability of these polymers owing to the aromatic structure and rigid main chain present in the PI structure have been reported. [15][16][17] Poly(amide imide) (PAI), which bears an amide group in the PI structure, exhibits excellent physical properties owing to the synergistic effect of amide and imide functional groups. Compared with other PIs, PAI exhibits higher thermomechanical properties, which are attributed to the hydrogen bonds between its amide chains and its excellent solubility in amide-based polar solvents.…”

Colorless and transparent poly(amide imide) nanocomposites containing organically modified hectorite

“…The poor processability and low solubility because of the aromatic structure and rigid main chain used in PI can be improved by signicantly overcoming the disadvantages of PI by employing structures such as esters, ethers, amides, and sulfones in the imide structure. [15][16][17] Among these, poly(amide imide) (PAI), which contains an amide group in the PI main chain, exhibits high thermal stability and improved mechanical properties because of the synergistic effect of polyamide and PI. In addition, compared to other PIs, PAI exhibits better thermal properties owing to the hydrogen bonding between the amide chains and good solubility in amide-based polar solvents.…”