Characterizing crack morphology toward improving ductile mode cutting of calcium fluoride

Anisotropy Dependence of Material Deformation Mechanisms in Nanoscratching Monocrystalline BaF2: Experiments and Atomic Simulations

“…This phase is followed by a sharp increase and subsequent decrease in dislocation length. Correlating with Figure 10a, dislocation annihilation contributes to significant fluctuations in friction, suggesting that full 12] directions. Throughout this process, the scratch depth and temperature remain constant, with atoms experiencing higher shear strain highlighted in red.…”

“…Their work revealed the anisotropic nature of the elastic–ductile–brittle transition in material wear and defined the conditions for ductile removal based on crystal plane and orientation. Employing diamond turning and orthogonal cutting techniques, Lee and Wang conducted microcutting tests on monocrystalline CaF 2 , elucidating the causes of crack formation during brittle microcutting and the anisotropic patterns of crack development and extension in ductile mode cutting. Hayama et al introduced a critical cutting depth model for monocrystalline MgF 2 , considering specific cutting energy, material mechanical properties, matrix slip system, and tool geometry.…”