Characterizing External Resistive, Inductive and Capacitive Loads for Micro-Switches

Toler, Benjamin; Coutu, Ronald A.

doi:10.1007/978-1-4614-4436-7_2

Cited by 5 publications

(8 citation statements)

References 7 publications

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“…To accomplish this, we investigated external circuit loading effects and specifically if certain configurations may aid in prolonging device life. 13 We will start with considering that these external circuit loading effects perform under dc conditions.…”

Section: A Low-frequency Ac Load Testsmentioning

confidence: 99%

Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading

Laurvick

Coutu

2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper investigates the performance and reliability of microcontacts under low-frequency and lowamplitude ac test conditions. Current microcontact theory is based on dc tests adapted to RF applications. To help better apply dc theory to RF applications, frequencies between 100 Hz to 100 kHz were experimentally investigated. Microcontacts designed to conduct performance and reliability measurements were used, which in prior dc testing typically lasted for 100 million cycles or more. Under ac loads, at similar power levels, eight devices were tested under cold-switching conditions, and only one was still operational at 10 million cycles. The effect of external circuitry on dc loaded devices was also considered. The experimental data were presented for dc conditions, which demonstrated that both a parallel capacitance with a microcontact and a series inductance were highly detrimental. For all six tested devices, failure occurred typically in 100 thousand cycles or less. However, utilizing series resistive/capacitive circuits as well as parallel resistor/inductive resulted in improved performance, with only one device of the four tested failing prematurely, but those that lasted showed less variation in measure contact resistance throughout the lifetime of the device. Two devices were tested with passive contact protection using parallel and series resistances, and both devices lasted for the full test duration. Finally, the effects of applying circuit protection to microcontacts and repeating ac test conditions were investigated. Reliability and device lifetime were extended significantly (9.1% success rate without protection was increased to 87% success rate). It was also observed in several instances that devices that failed showed subtle signs of variance during contact closure measurements in the range of 5-30 μ N, indicating a possible means for accurately predicting device failure. For these failed devices, notable physical damage was observed using a scanning electron microscope.

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Section: A Low-frequency Ac Load Testsmentioning

confidence: 99%

Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading

Laurvick

Coutu

2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…In our previous work, a theory was proposed to explain the effects of external loads on micro-contact behavior [12]. According to this theory, the presence of transient charge on the contacting surfaces must lead to extremely high current density (particularly at weakened regions) during contact closure which ultimately results in device failure.…”

Section: Discussionmentioning

confidence: 99%

Experimental Validation of External Load Effects for Micro-Contacts under Low Frequency, Low Amplitude Alternating Current (AC) Test Conditions

2018

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Abstract:The use of micro-contacts has been demonstrated in various radio frequency (RF) applications. However, the premature failure of such devices under alternating current (AC) operations is still a hurdle to further development. In this work, modified gray scale lithography is performed to fabricate two types of gold-gold (Au-Au) micro-contacts: hemispherical-planar and hemispherical-2D pyramid. The performance of these devices was investigated under low frequency, low amplitude AC conditions with external circuit loads. A custom-made experimental setup which uses various load configurations, controls the frequency of the applied voltage and modifies the cycle rate of switch operation to obtain the contact resistance as a function of number of cycles (up to 10 7 cycles). Nearly 87% of the tested devices (13 out of 15 hemispherical-planar micro-contacts) were found to be in good operational condition and passed the 10 million cycle mark successfully. A steady gain and large swing in the value of contact resistance was also observed near the end of all, but one, tests. Such changes in contact resistance were found to be permanent as none of the devices recovered completely. On the other hand, the hemispherical-2D pyramid micro-contact performed better than the planar one as it also passed 10 7 cycle mark with low and remarkably stable contact resistance throughout the testing span. This study suggests that micro-contacts with 'engineered' surface structures with external loads applied are a viable solution to premature failure and high contact resistance in micro-contacts under low frequency AC operations.

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“…Configurations (5) and (6) apply reactive loads in what is theorized to be beneficial RL and RC configuration, and these are combined in configuration (8). Configuration (7) is somewhat unique in that it is purely resistive, but according to our original paper might provide some level of contact protection [1].…”

Section: Background and Methodologymentioning

confidence: 99%

“…HIS work is intended to experimentally validate and expand on the concepts outlined in a previous study [1]. From that work, contact resistance modeling is the starting point [2] but the true focus is how micro-contacts interact with external loads.…”

Section: Introductionmentioning

confidence: 99%

Experimental validation of external load effects on micro-contact performance and reliability

Laurvick

Coutu

2015

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)

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-This paper presents a follow-on study previously presented at the Holm Conference. In the previous work, it was theorized that micro-switch performance and reliability was directly related to the type of external load that was connected. In particular, unintended capacitive loads may discharge at unpredictable times during switch operation and severely degrade or destroy micro-contact surfaces while properly configured loads may actually enhance performance. The severity of this potential vulnerability can be mitigated by purposely including specific circuit elements in various load configurations. This current study is to experimentally investigate and analyze this phenomenon. Using microelectromechanical systems (MEMS) based devices, we have the ability to efficiently and inexpensively fabricate large numbers of identical micro-contact pairs and then connect them to external loads of interest. Using this approach, it was demonstrated that both performance and reliability can be drastically affected by loading. In all cases tested, series inductance and parallel capacitance resulted in premature failure of the micro-contacts tested. Various protective configurations were also tested and all such devices lasted to the targeted 10M cycles of operation with little sign of imminent failure.

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Characterizing External Resistive, Inductive and Capacitive Loads for Micro-Switches

Cited by 5 publications

References 7 publications

Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading

Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading

Experimental Validation of External Load Effects for Micro-Contacts under Low Frequency, Low Amplitude Alternating Current (AC) Test Conditions

Experimental validation of external load effects on micro-contact performance and reliability

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