Characterizing the performance of eddy current probes using photoinductive field-mapping

Moulder, John C.; Nakagawa, N.

doi:10.1007/bf01616489

Cited by 4 publications

(2 citation statements)

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“…The photoinductive method is a relatively new method of nondestructive evaluation [14][15][18][19] offering fine spatial resolution, e.g., of the order of tens of microns. The dissertation problem is to devise a numerical method that reconstructs the shape and size of a crack in a (nonmagnetic) metallic test specimen from given photoinductive data.…”

Section: The Dissertation Problemmentioning

confidence: 99%

“…This constant value can be chosen to be zero. Therefore the locus X = X(0,fOU (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18) y = r((J),fOU (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19) can be identified as the union of the buried and the surface-breaking edges of the crack. The strategy of reconstructing the crack is therefore to use the measured voltages to determine 0, *F,X,Y, and hence the buried edge of the crack.…”

Section: Sketch Of the Derivations In The Unfolding Modelmentioning

confidence: 99%

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Theoretical study: depth of small cracks (circa 100 microns) from photoinductive data

Sethuraman

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Section: The Dissertation Problemmentioning

confidence: 99%

Section: Sketch Of the Derivations In The Unfolding Modelmentioning

confidence: 99%

Theoretical study: depth of small cracks (circa 100 microns) from photoinductive data

Sethuraman

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A Novel Multiphysics Sensoring Method Based on Thermal and EC Techniques and Its Application for Crack Inspection

Tai

Pan

2008

2008 IEEE International Conference on Sensor Networks, Ubiquitous, and Trustworthy Computing (Sutc 2008)

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Crack inspection is a critical issue in quantitative nondestructive evaluation (NDE). The eddy current (EC) method is effective for surface discontinuities detection, but the spatial resolution of conventional EC method is constrained by the size of EC probe. The photoinductive (PI) imaging method is a NDE technique that combines EC and laser-based thermal imaging methods. It had been clearly demonstrated that PI method is a high-resolution technique from practical experiments. In this paper, the numerical multiphysics simulation of PI imaging have been performed with 2D transient using the finite element method (FEM) to characterize corner cracks at the edge of a Ti-6Al-4V bolt hole specimen. The FEM simulation results of 0.25-mm, 0.50-mm, and 0.75-mm rectangular notches are showed and discussed. The results show that the PI imaging has higher spatial resolution in the area of the defect in 2D models as compared with the conventional EC images. We demonstrate that the PI method is a novel sensoring method for characterizing the geometric shape of cracks.

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Multiphysics Modeling and Analysis of the Photoinductive Imaging Effect for Crack Detection

Tai

Pan

2010

IEEE Trans. Instrum. Meas.

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Characterizing the performance of eddy current probes using photoinductive field-mapping

Cited by 4 publications

References 4 publications

Theoretical study: depth of small cracks (circa 100 microns) from photoinductive data

Theoretical study: depth of small cracks (circa 100 microns) from photoinductive data

A Novel Multiphysics Sensoring Method Based on Thermal and EC Techniques and Its Application for Crack Inspection

Multiphysics Modeling and Analysis of the Photoinductive Imaging Effect for Crack Detection

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