Proceedings of the 48th Design Automation Conference 2011
DOI: 10.1145/2024724.2024848
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Characterizing within-die and die-to-die delay variations introduced by process variations and SOI history effect

Abstract: Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation techniques to reduce the detrimental effects of delay variations, particularly those that occur within-die, new methods of measuring delay variations within actual products are needed. The data provided by such techniques can also be used for validating models, i.e., can assist with model-to-hardware correlation. In this paper, we propo… Show more

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Cited by 7 publications
(3 citation statements)
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“…Though repeating measurement can reduce these errors [27], the delays of selected paths can still not be obtained accurately [16], [18], [27]. Hence, the fitting errors are further evaluated when measurement errors with Gaussian distribution (SD ≈ 1.6%) exist.…”
Section: Fitting Errorsmentioning
confidence: 99%
“…Though repeating measurement can reduce these errors [27], the delays of selected paths can still not be obtained accurately [16], [18], [27]. Hence, the fitting errors are further evaluated when measurement errors with Gaussian distribution (SD ≈ 1.6%) exist.…”
Section: Fitting Errorsmentioning
confidence: 99%
“…It has been shown that the frequency variation can be as much as 30% and up to 20x variations in chip leakage power for a processor designed in 180nm technology [9]. Based on a test structure fabricated in IBM's 65 nm Silicon-On-Insulator (SOI) technology, Aarestad et al [10] showed that worst case delay variations caused by chip-to-chip process variations can be as large as 21%. As design parameters of processing cores deviate from their nominal values, the system design objectives can be severely compromised, or even worse, a computing system can malfunction or even fail.…”
Section: Introductionmentioning
confidence: 99%
“…It has been shown that the frequency variation can be as much as 30% and up to 20x variations in chip leakage power for a processor designed in 180nm technology [24]. Based on a test structure fabricated in IBM's 65 nm Silicon-On-Insulator (SOI) technology, Aarestad et al [3] showed that worst case delay variations caused by chip-to-chip process variations can be as large as 21%. As design parameters of processing cores deviate from their nominal values, the system design objectives can be severely compromised, or even worse, a computing system can malfunction or even fail.…”
Section: Related Workmentioning
confidence: 99%