2004
DOI: 10.1143/jjap.43.6880
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Charge Assisted Deposition of Polycrystalline Silicon Thin Films by Cesium Sputter Ion Beam Deposition

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“…Because of the RF plasma distortion in the sputtering process, direct measurement of negative ions, as shown in our previous research [14], was so difficult that we calculate optimum cesium coverage on the target surface from a theoretical model. It was reported that the work function of the target surface can be minimized when the target surface is covered with a 0.6 monolayer (ML) of cesium [15].…”
Section: Resultsmentioning
confidence: 99%
“…Because of the RF plasma distortion in the sputtering process, direct measurement of negative ions, as shown in our previous research [14], was so difficult that we calculate optimum cesium coverage on the target surface from a theoretical model. It was reported that the work function of the target surface can be minimized when the target surface is covered with a 0.6 monolayer (ML) of cesium [15].…”
Section: Resultsmentioning
confidence: 99%