1991
DOI: 10.1016/0304-3886(91)90010-d
|View full text |Cite
|
Sign up to set email alerts
|

Charge transport trough a “metal-thick insulator-metal” structure during impulse voltage excitation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
4
0
6

Year Published

1996
1996
2020
2020

Publication Types

Select...
5
3

Relationship

0
8

Authors

Journals

citations
Cited by 12 publications
(10 citation statements)
references
References 19 publications
0
4
0
6
Order By: Relevance
“…It is confirmed experimentally that the voltage is still enhanced and even larger than the Fermi level difference between N- and P-type semiconductors when the thickness of the insulating layer is larger than 100 nm. It is inferred that the impact ionization should lead to the current transport through the insulating layer (Dervos et al., 1991, Kim and Rudd, 1994, Hwang et al., 1996, Solomon and Klein, 1975, Feng et al., 2019), whereas other transportation processes such as inelastic hopping also cannot be neglected (Xu et al., 1990, Xu et al., 1995, Vecchio et al., 2019), which will be studied in the following works. It is reasonable that some rebounded hot electrons/holes can involve in the impact ionization, since there are ultrahigh built-in electric field (E ≈ 3 × 10 5 V/cm for the case of 100 nm SiO 2 as shown in Figure 2F).…”
Section: Resultsmentioning
confidence: 99%
“…It is confirmed experimentally that the voltage is still enhanced and even larger than the Fermi level difference between N- and P-type semiconductors when the thickness of the insulating layer is larger than 100 nm. It is inferred that the impact ionization should lead to the current transport through the insulating layer (Dervos et al., 1991, Kim and Rudd, 1994, Hwang et al., 1996, Solomon and Klein, 1975, Feng et al., 2019), whereas other transportation processes such as inelastic hopping also cannot be neglected (Xu et al., 1990, Xu et al., 1995, Vecchio et al., 2019), which will be studied in the following works. It is reasonable that some rebounded hot electrons/holes can involve in the impact ionization, since there are ultrahigh built-in electric field (E ≈ 3 × 10 5 V/cm for the case of 100 nm SiO 2 as shown in Figure 2F).…”
Section: Resultsmentioning
confidence: 99%
“…At applied forward voltages, the electric field induced hot electrons accumulated at the interface of the n-Si/HfO 2 heterostructure can cross the thick dielectric barrier (50 nm) by the electron-impact ionization mechanism [ 35 , 36 , 37 , 38 ] and are injected into the graphene. The superior electronic behavior of graphene [ 39 , 40 , 41 , 42 , 43 ] (like strong electron–electron interactions, high electrical conductivity along the plane, high charge carrier mobility, and weak charge carrier scattering, etc.)…”
Section: Resultsmentioning
confidence: 99%
“…Tunneling through the NiO layers may occur for the smallest modulation wavelength samples [12] and would be evidences by a sharp reduction in r with decreasing L. In the literature, such metal-insulator-metal systems are most often studied in terms of tunneling processes [13][14][15]. High field transport mechanisms such as field assisted thermal ionization (Poole-Frenkel effect) [16], or electrode to bulk limited processes [12], are not relevant to these low voltage (field independent) resistivity measurements.…”
mentioning
confidence: 99%