Charged Device Model Reliability of Three-Dimensional Integrated Circuits

Shukla, Vrashank; Rosenbaum, Elyse

doi:10.1109/tdmr.2015.2491308

Cited by 7 publications

(1 citation statement)

References 14 publications

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“…Ensuring the reliability of 3D stacked devices poses significant challenges due to the complex interactions between stacked dies, different materials, and varied thermal and mechanical stresses(Huang et al, 2019). Table4summarizes key reliability and testing challenges associated with 3D stacking.…”

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confidence: 99%

Advancements in Semiconductor Packaging: Exploring the Potential of 3D Multi-Die Stacking Technology

et al. 2023

IJFMR

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The rapid evolution of semiconductor packaging technologies has led to the emergence of 3D multi-die stacking as a promising approach for achieving higher levels of integration and performance in electronic devices. This research paper comprehensively examines the advancements, applications, challenges, economic implications, regulatory considerations, and future prospects of 3D stacking technology. Through an in-depth analysis of current research, industry trends, and market dynamics, the paper elucidates the technical, economic, and regulatory aspects shaping the adoption and development of 3D stacking. Key findings highlight the potential benefits of 3D stacking in enhancing device functionality, optimizing manufacturing processes, and addressing environmental sustainability. The paper also identifies critical challenges such as thermal management, signal integrity, and regulatory compliance that semiconductor manufacturers must overcome to realize the full potential of 3D stacking. Furthermore, the paper outlines future directions, including integration with emerging technologies, advancements in materials and processes, and sustainability initiatives, to drive continued innovation in semiconductor packaging.

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confidence: 99%