Chemical aspects of tool wear in single point diamond turning

Paul, Ed; Evans, Christopher J.; Mangamelli, A; McGlauflin, Michael L.; Polvani, Robert S.

doi:10.1016/0141-6359(95)00019-4

Cited by 303 publications

(123 citation statements)

References 21 publications

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“…Yan et al [64] explained the diamond cutting behaviour of silicon at a DoC less than 1 µm. Tool wear mainly happened on tool flank face having the common wear patterns [65][66][67][68]. Similarly, the tool cutting edges underwent two processes in nanoscale cutting of silicon wafers: Wear on main cutting edge increasing its sharpness but not changing its shape so as to enhance chip formation in DMC, which can be attributed to the increment of compressive stress in the cutting zone; and micro/nanogrooves generated at flank face forming some microcutting edges [61].…”

Section: Surface Finishmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Surface Finishmentioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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“…Silicon is nominally diamond turnable based upon its chemical composition, but it causes significant tool wear resulting in a steady deterioration of surface finish and an increase of subsurface damage [1]. Furthermore, relatively small depths of cut and feed rates are required for material removal in the ductile regime.…”

Section: Introductionmentioning

confidence: 99%

On the effect of crystallographic orientation on ductile material removal in silicon

O’Connor

Marsh

Couey

2005

Precision Engineering

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In this work the critical chip thickness for ductile regime machining of monocrystalline, electronic-grade silicon is measured as a function of crystallographic orientation on the (0 0 1) cubic face. A single-point diamond flycutting setup allows sub-micrometer, non-overlapping cuts in any direction while minimizing tool track length and sensitivity to workpiece flatness. Cutting tests are performed using chemically faceted, −45 • rake angle diamond tools at cutting speeds of 1400 and 5600 mm/s. Inspection of the machined silicon workpiece using optical microscopy allows calculation of the critical chip thickness as a function of crystallographic orientation for different cutting conditions and workpiece orientations. Results show that the critical chip thickness in silicon for ductile material removal reaches a maximum of 120 nm in the [1 0 0] direction and a minimum of 40 nm in the [1 1 0] direction. These results agree with the more qualitative results of many previous efforts.

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“…This observation cannot be explained only by differences in the mechanical properties of the materials such as hardness and fracture toughness. A search through the periodic table suggests the presence of a chemical component in diamond tool wear, as has been pointed out by Paul et al [21]. The reduction in diamond tool wear achieved by ultrasonic vibration cutting [22], in which the contact between the cutting edge and the workpiece material is interrupted periodically at a high frequency, also points in this direction.…”

Section: Diamond Machiningmentioning

confidence: 89%

Micro-machining

Brinksmeier

Preuss

2012

Phil. Trans. R. Soc. A.

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Manipulating bulk material at the atomic level is considered to be the domain of physics, chemistry and nanotechnology. However, precision engineering, especially micromachining, has become a powerful tool for controlling the surface properties and sub-surface integrity of the optical, electronic and mechanical functional parts in a regime where continuum mechanics is left behind and the quantum nature of matter comes into play. The surprising subtlety of micro-machining results from the extraordinary precision of tools, machines and controls expanding into the nanometre range-a hundred times more precise than the wavelength of light. In this paper, we will outline the development of precision engineering, highlight modern achievements of ultra-precision machining and discuss the necessity of a deeper physical understanding of micro-machining.

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Chemical aspects of tool wear in single point diamond turning

Cited by 303 publications

References 21 publications

A review on ductile mode cutting of brittle materials

A review on ductile mode cutting of brittle materials

On the effect of crystallographic orientation on ductile material removal in silicon

Micro-machining

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