Chemical Bond

Бацанов, С. С.; Batsanov, Andrei S.

doi:10.1007/978-94-007-4771-5_2

Cited by 2 publications

(2 citation statements)

References 404 publications

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“…Unlike the physical bonds such as hydrogen bonds and electrostatic bonds, which were dissociated under high temperature, the interpenetrated chemically cross-linked networks were quite stable under high temperature due to the thermal stability of the corresponding chemical bonds. 41,50,51 The reduced mechanical properties of O-PAA-PVA-B at 60 °C compared to those at ambient temperature were attributed to the heat-induced partial dissociation of hydrogen bonds. 52 3.3.…”

Section: Resultsmentioning

confidence: 99%

A Solvent Co-cross-linked Organogel with Fast Self-Healing Capability and Reversible Adhesiveness at Extreme Temperatures

Wang

Tian

et al. 2020

ACS Appl. Mater. Interfaces

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Antifreezing gels are promising in diverse engineering applications such as structural soft matters, sensors, and wearable devices. However, the capability of fast self-healing and reversible adhesiveness still remain a huge challenge for gels at extreme temperatures. Here, we proposed a solvent-involved cross-linking system composed of polyacrylic acid, polyvinyl alcohol, borax, ethylene glycol, and water, capable of antifreezing below −90 °C. It was not only antifreezing, anticrystalline, and abundant in dynamic bonds but also highly transparent, stretchable (over 800%), and conductive over the scope of temperature from −60 to 60 °C. Moreover, this gel could self-heal within 1 min and repeatedly adhere to multiple substrates including glass, metal, and rubber with an adhesive strength greater than 18 kPa. These key functions of the gel could be mostly preserved after 5 days of storage at 70% relative humidity. It is anticipated that our research opens a new scope for high-performance extreme environment-tolerant adhesives or wearable devices.

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Section: Resultsmentioning

confidence: 99%

A Solvent Co-cross-linked Organogel with Fast Self-Healing Capability and Reversible Adhesiveness at Extreme Temperatures

Wang

Tian

et al. 2020

ACS Appl. Mater. Interfaces

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“…Furthermore, bond order is one of the most important descriptors to describe the characteristic of electron distribution in molecules. , Wiberg bond order can be used to represent the covalence of chemical bond. At the same time, the value of bond energy represents the strength of the interaction between two atoms . They are used to estimate the strength of Se–N interactions.…”

Section: Results and Discussionmentioning

confidence: 99%

Dynamic Conversion Between Se–N Covalent and Noncovalent Interactions

et al. 2016

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Se-N dynamic covalent bond is a new dynamic covalent bond which has applications in the fabrication of stimuli responsive and self-healing functional materials. Although recent advances have been achieved in the experimental aspect, little is known about the formation mechanism of Se-N dynamic covalent bond. Here the structures and nature of Se-N dynamic covalent bond between three kinds of pyridine derivatives R-CHN, [pyridine (R = H), 4-methylpyridine (R = CH), 4-dimethylamino-pyridine (R = N(CH))] and phenylselenyl bromine (PhSeBr) have been analyzed using density functional theory. The interactions between Se atom in PhSeBr and N atom in pyridine or pyridine derivatives can be divided into three models: dissociation, nonbonding interaction and covalent bond interaction. Quantum chemical calculations on three series compounds show that these three models can convert mutually, which results in the generation of Se-N dynamic covalent bond. Solvent effects produced in polar solvents such as CHCl can make the conversion between Se-N covalent bond and Se···N nonbonding interactions easier. The kind of the substituents in pyridine ring can affect the conversion process: the stronger the electron-donating ability of the substituent, the easier the structure transformation.

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Chemical Bond

Cited by 2 publications

References 404 publications

A Solvent Co-cross-linked Organogel with Fast Self-Healing Capability and Reversible Adhesiveness at Extreme Temperatures

A Solvent Co-cross-linked Organogel with Fast Self-Healing Capability and Reversible Adhesiveness at Extreme Temperatures

Dynamic Conversion Between Se–N Covalent and Noncovalent Interactions

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