Chemical effects in the Auger spectrum of copper–oxygen compounds

Timmermans, Bert; Reniers, François; Hubin, Annick; Buess‐Herman, C.

doi:10.1016/s0169-4332(98)00764-8

Cited by 40 publications

(24 citation statements)

References 11 publications

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“…3c, top view); this structure is unfavorable to diffusion. [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] Besides this, in sample C7025, some whiskers are growing on the oxide surface. The whiskers on the oxide surface generally mean that internal compressive stress developed in the course of oxidation.…”

Section: Sem Images Of Oxide Filmmentioning

confidence: 99%

“…3 Some researchers have studied oxidation of copper alloy lead frames. [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] Lahiri et al 4 found that oxidation kinetics of copper alloys obeyed a logarithmic growth law at temperatures ranging from 200°C to 300°C, and that the copper substrate played an important role in oxidation. Cho and Paik 5 found that the oxide growth followed a parabolic growth rate law in the temperature range from 150°C to 300°C, and that formation of CuO would retard the overall oxidation rate.…”

Section: Introductionmentioning

confidence: 99%

“…AES Binding Energies (eV) for Copper and Copper OxidesBinding Energy Peak (eV)8 Binding Energy Peak in the Experiment (eV)Table V. Thickness of Oxide Films and CuO/Cu 2 O Ratio for Copper Alloys Thickness of CuO Film (nm) Thickness of Cu 2 O Film (nm) Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion…”

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confidence: 99%

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Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Chen

et al. 2008

Journal of Elec Materi

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Oxidation of four typical lead frame copper alloys was investigated. The oxidation rate and adhesion strength of oxide films to copper alloy substrates were studied by measuring the thickness and carrying out peel tests. The results show that, although copper alloys C5191 and C7025 have thinner oxide films, a lower adhesion strength and a higher proportion of CuO were obtained than in the other copper alloys EFTEC64T and C194. The adhesion strength is mainly influenced by the structure of the oxide film of the copper alloys, especially the CuO/Cu 2 O ratio in the film. The highest adhesion strength is obtained for the copper oxide film with a basic structure of CuO/Cu 2 O/Cu and a CuO/Cu 2 O ratio of about 0.1. The segregation of additional elements in the copper alloy plays an important role in the oxide film structure.

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Section: Sem Images Of Oxide Filmmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Chen

et al. 2008

Journal of Elec Materi

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“…We have already investigated the chemical effects on the KLL lines in Al compounds, 1 and copper compounds were also studied. 2 The Auger lineshape of CVV transitions has been used for a long time as a fingerprint for a selected chemical environment. We focus in this work on the shape of the Al LVV low-energy transitions and the C KVV peaks.…”

Section: Introductionmentioning

confidence: 99%

“…We focus in this work on the shape of the Al LVV low-energy transitions and the C KVV peaks. Al was chosen for its fundamental interest, there is indeed still a controversy about the theoretical interpretation of the valence Auger peaks of Al 2 Carbon has been chosen because it has an intermediate behaviour between Al (band-like spectrum) and Cu (atomic-like spectrum). Model Auger spectra of carbon in different chemical environments have been recorded.…”

Section: Introductionmentioning

confidence: 99%

Experimental and theoretical study of CVV Auger peaks of selected aluminium and carbon compounds

Timmermans

Hubin

Vaeck

et al. 2004

Surface & Interface Analysis

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The initial oxidation of polycrystalline thorium

Bagge‐Hansen

Outlaw

Zhu

et al. 2010

Surface & Interface Analysis

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The initial oxidation of clean, polycrystalline α-Th from background CO/CO 2 and saturation of the Th surface by O 2 has been examined by angle-resolved Auger electron spectroscopy (ARAES) and time of flight secondary ion mass spectrometry (ToF-SIMS). Following dissociative adsorption of very low doses of background CO/CO 2 (<1 L), the carbon surface population was dominant and spontaneously formed thorium carbide. The accompanying oxygen population increased at a rate roughly one-third that of the carbon, suggesting simultaneous oxygen incorporation into the bulk. To further corroborate the surface kinetics of adsorbed oxygen, O 2 was admitted, following heating and sputter cleaning of the Th; some oxygen atoms continued to diffuse into the bulk until formation of stoichiometric ThO 2 at ∼37 L. ARAES measurements showed an oxygen concentration gradient in the near-surface region confirming rapid oxygen incorporation at low doses; however, once the surface is saturated, virtually no variation in the oxygen intensity is observed. AES and ToF-SIMS depth profiling revealed complete oxide formation to a depth of 2 nm.

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Chemical effects in the Auger spectrum of copper–oxygen compounds

Cited by 40 publications

References 11 publications

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Experimental and theoretical study of CVV Auger peaks of selected aluminium and carbon compounds

The initial oxidation of polycrystalline thorium

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