2019
DOI: 10.1016/j.apsusc.2019.07.021
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Chemical evolution of target surfaces during RF magnetron sputtering and its effect on the performance of TCO films

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Cited by 8 publications
(5 citation statements)
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“…During the growth of transparent conductive oxide films, it has been revealed that the selection of targets can significantly influence the optical properties of the films [30][31][32][33][34]. Additionally, arc discharge induced by target conditions has been a common phenomenon for sputtering cathodes, particularly in reactive sputtering [35].…”
Section: Introductionmentioning
confidence: 99%
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“…During the growth of transparent conductive oxide films, it has been revealed that the selection of targets can significantly influence the optical properties of the films [30][31][32][33][34]. Additionally, arc discharge induced by target conditions has been a common phenomenon for sputtering cathodes, particularly in reactive sputtering [35].…”
Section: Introductionmentioning
confidence: 99%
“…Insufficient cooling can result in target material cracking, reducing the target's lifespan and affecting deposition process repeatability [31]. Furthermore, variable sputtering rates at grains, grain boundaries, and holes generate nodules on the surface, leading to irregular morphology [32]. In plasmas, most of the voltage drop occurs within a very thin sheath on the target surface.…”
Section: Introductionmentioning
confidence: 99%
“…The values of the electron and holes Solar 2021, 1 31 mobility are also highly important considering the potential of this material in applications such as TCO: thanks to this, ZnO exhibits high charge carrier mobilities as compared to other compounds used in photovoltaic devices [17]. Different technologies for the preparation of TCOs layers are used, predominantly physical techniques such as magnetron sputtering and chemical vapor deposition [18], instead of chemical routes (sol-gel or spray pyrolysis) [19]. In general, chemical methods are promising ways for TCOs production due to their efficient material use and high throughput.…”
Section: Introductionmentioning
confidence: 99%
“…Although some research has been done on the analysis of sputtered thin films, the alteration of the target microstructure as a result of the sputtering process has been severely overlooked. It is well known that the destructive plasma–microstructure interactions occurring on the surface of the target can lead to a ‘racetrack’ phenomenon which is clearly visible to the naked eye (Nakano et al ., 2015; Wu et al ., 2019). Furthermore, experimental studies have shown that during plasma‐enhanced chemical vapour deposition, the resulting product morphology is greatly influenced by the plasma parameters (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…These include gas composition (Bose et al ., 2018; Ţălu et al ., 2018), flow rate/pressure (Ma et al ., 2019; Lee et al ., 2020; Shakoury et al ., 2020), deposition time (Dallaeva et al ., 2012; Ma et al ., 2019; Lee et al ., 2020), deposition rate (Taheriniya et al ., 2018), power (Ma et al ., 2019; Lee et al ., 2020), distance of substrate from target (Sangwaranatee et al ., 2018), substrate temperature (C. Taheriniya et al ., 2018; Ma et al ., 2019; Rajabi Kalvani et al ., 2019) and the target fabrication process (Wu et al ., 2012, 2019; Liu et al ., 2020). Since the target itself is one of the key factors contributing to the microstructure of the substrate, the evaluation of plasma–microstructure is key to not only better understanding the process but also to allow for optimisation (Dallaeva et al ., 2012; Wu et al ., 2019; Chen et al ., 2020). When competing phases occur, secondary phases may emerge leading to various effects such as Zener pinning that ultimately affect the local chemical reactivity (Huang et al ., 2018; Thiruvalluvan et al ., 2018).…”
Section: Introductionmentioning
confidence: 99%