Chemical–mechanical polishing of low-scatter optical surfaces

McIntosh, Robert; Paquin, Roger A.

doi:10.1364/ao.19.002329

Cited by 15 publications

(4 citation statements)

References 8 publications

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“…Next, researchers soon invented CMP based on the original mechanical and chemical polishing. CMP is the most widely used technique that, through the combined action of chemistry and mechanics, avoids the surface damage of pure mechanical polishing and the low efficiency of refined chemical polishing (Cameron and Van Rensburg, 1965; McIntosh and Paquin, 1980). However, CMP also combines the disadvantages of mechanical and chemical polishing.…”

Section: Compared With Other Polishing Techniquesmentioning

confidence: 99%

Progress in the study of electrorheological polishing: A review

Sun

Zhao

Yin

2023

Journal of Intelligent Material Systems and Structures

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Electrorheological polishing (ERP) is an important field-assisted polishing method, which can reduce abrasive loss and improve machining efficiency by using the electric field-induced electrorheological (ER) effect to help the abrasive to overcome the centrifugal force caused by high rotating speed during polishing. ERP has many advantages, including high efficiency, high precision, facile polishing for a small object, and a good application prospect in polishing optical devices and hard molds. This review describes the research progress in ERP in the past two decades. The mechanism of electrorheological polishing is analyzed from two aspects of electrorheological effect and dielectrophoresis. According to the time sequence of electrorheological polishing development, two kinds of ERP materials including the simple mixing system and composite particle system are introduced. ERP electrodes including off-axis bipolar electrode, needle-ring electrode, needle-like single electrode, one-sided patterned electrode, and one-sided simple composite electrode are described. From the two characterization quantities of removal rate and surface quality, the industrial factors affecting the ERP effect are discussed. The advantages and disadvantages of ERP and other polishing processes are compared. Finally, the remaining challenges and possible development trends in ERP technology for the future outlook are proposed.

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Section: Compared With Other Polishing Techniquesmentioning

confidence: 99%

Progress in the study of electrorheological polishing: A review

Sun

Zhao

Yin

2023

Journal of Intelligent Material Systems and Structures

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“…In 1991, a circuit compensation system [48] was combined with the capacitive pressure sensors with the elimination of the thick supporting edge around a thin film to produce a chip area of 1.1 mm × 0.45 mm. By utilizing chemical mechanical polishing (CMP) [49][50][51], the device was further thinned to 262 μm.…”

Section: Size Change With Process Developmentmentioning

confidence: 99%

Recent Progress of Miniature MEMS Pressure Sensors

Song

et al. 2020

Micromachines

172

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Miniature Microelectromechanical Systems (MEMS) pressure sensors possess various merits, such as low power consumption, being lightweight, having a small volume, accurate measurement in a space-limited region, low cost, little influence on the objects being detected. Accurate blood pressure has been frequently required for medical diagnosis. Miniature pressure sensors could directly measure the blood pressure and fluctuation in blood vessels with an inner diameter from 200 to 1000 μm. Glaucoma is a group of eye diseases usually resulting from abnormal intraocular pressure. The implantable pressure sensor for real-time inspection would keep the disease from worsening; meanwhile, these small devices could alleviate the discomfort of patients. In addition to medical applications, miniature pressure sensors have also been used in the aerospace, industrial, and consumer electronics fields. To clearly illustrate the “miniature size”, this paper focuses on miniature pressure sensors with an overall size of less than 2 mm × 2 mm or a pressure sensitive diaphragm area of less than 1 mm × 1 mm. In this paper, firstly, the working principles of several types of pressure sensors are briefly introduced. Secondly, the miniaturization with the development of the semiconductor processing technology is discussed. Thirdly, the sizes, performances, manufacturing processes, structures, and materials of small pressure sensors used in the different fields are explained in detail, especially in the medical field. Fourthly, problems encountered in the miniaturization of miniature pressure sensors are analyzed and possible solutions proposed. Finally, the probable development directions of miniature pressure sensors in the future are discussed.

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“…At present, Supersmooth surfaces can be obtained by special polishing techniques, for example, float polishing, Teflon polishing, chemical mechanical polishing, and magnetorheological finishing (MRF), laser polishing， plasma-assisted chemical etching (PACE) polishing and ion beam polishing etc [1][2][3][4][5][6] . But, to produce big aperture optical elements with flat and supersmooth surfaces with atomic scale roughness is still a challenge in optical fabrication.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of flat and supersmooth surfaces with bowl-feed polishing process

Shen

Wang

et al. 2007

3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technolo

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Low-scatter supersmooth optical components are wildly used for critical applications such as high power laser systems, mirrors for ring laser gyros, and low-scatter windows. In this paper, a bowl-feed polishing process with fine abrasives to get flat and extremely smooth surfaces is presented. We consider the machining of super-smooth surfaces as a chain consisted of some key nodes, not merely a polishing process. So after the samples of fused silica have been grinded, fine grinded and lapping previously, each step is controlled strictly, a bowl-feed polishing process is adopted to produce the supersmooth surfaces. During the whole polishing process, in order to achieve consistently reliable and meaningful values of both roughness and flatness, every effort is made to get the proper polishing parameters. Abrasives with different grain size distribution and the temperature are taken into account particularly. Two characters of the samples, roughness and flatness, are concerned about in this study. Process controlling by interferometer implies that surface shape is maintained to better than λ/15 RMS (λ=632.8nm), 100 mm in diameter for an extended periods of time, of the order of days. The surface roughness is tested by an interference microscopy. In best cases, the final test result of surface roughness is better than 0.8nm RMS.

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Chemical–mechanical polishing of low-scatter optical surfaces

Cited by 15 publications

References 8 publications

Progress in the study of electrorheological polishing: A review

Progress in the study of electrorheological polishing: A review

Recent Progress of Miniature MEMS Pressure Sensors

Fabrication of flat and supersmooth surfaces with bowl-feed polishing process

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