Chemical Reaction between Tantalum and Gallium under High Pressure

Fujinaga, Yasuo; Murakami, Yoshihiro

doi:10.2320/matertrans.44.377

Cited by 4 publications

(2 citation statements)

References 10 publications

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“…To alleviate the corrosion issue, corrosion-resistant metals have been put forward, such as Ta [ 23 ], W [ 24 ], Ti-Ni (and Ni) [ 25 ], and Ni-W alloys [ 26 ]. Similarly, diamond coatings have been investigated for their compatibility with liquid metals and metal melts.…”

Section: Introductionmentioning

confidence: 99%

Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond

Handschuh-Wang,

Wang,

Zhang

et al. 2024

Materials

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Thermal transport is of grave importance in many high-value applications. Heat dissipation can be improved by utilizing liquid metals as thermal interface materials. Yet, liquid metals exhibit corrosivity towards many metals used for heat sinks, such as aluminum, and other electrical devices (i.e., copper). The compatibility of the liquid metal with the heat sink or device material as well as its long-term stability are important performance variables for thermal management systems. Herein, the compatibility of the liquid metal Galinstan, a eutectic alloy of gallium, indium, and tin, with diamond coatings and the stability of the liquid metal in this environment are scrutinized. The liquid metal did not penetrate the diamond coating nor corrode it. However, the liquid metal solidified with the progression of time, starting from the second year. After 4 years of aging, the liquid metal on all samples solidified, which cannot be explained by the dissolution of aluminum from the titanium alloy. In contrast, the solidification arose from oxidation by oxygen, followed by hydrolysis to GaOOH due to the humidity in the air. The hydrolysis led to dealloying, where In and Sn remained an alloy while Ga separated as GaOOH. This hydrolysis has implications for many devices based on gallium alloys and should be considered during the design phase of liquid metal-enabled products.

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Section: Introductionmentioning

confidence: 99%

Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond

Handschuh-Wang,

Wang,

Zhang

et al. 2024

Materials

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“…Tantalum has been used as the electrode for the measurement of electrical resistance against metals under high pressure. Although it showed significant reactivity with gallium at high temperature (400 °C higher than melting temperature) 14) , the application of tantalum as the electrode is possible for a gallium-alloy as the liquidus temperature rises at low gallium content and the tantalum tends to be inactive. This is suitable for Na flux growth, which is performed using Ga-Na alloys melt with low Ga content.…”

mentioning

confidence: 99%

Monitoring of Ga-Na melt electrical resistance and its correlation with crystal growth on the Na Flux method

Tandryo

Murakami

Kitamura

et al. 2019

Appl. Phys. Express

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The electrical resistance of Ga-Na melt used for gallium nitride crystal growth on a Na flux was investigated with the four-point probe method. Electrical resistance of melt was measured isothermal at 870 °C as the function of time. Pressure decay measurement and crystal growth evaluation were performed and show that the electrical resistance of melt and the number of dissolved nitrogen were strongly correlated. Time-dependency of nitrogen concentration in melt was revealed and verified from the increasing growth rate. The strong correlation between measurement and crystal growth shows the high potential use of electrical resistance measurements as the monitoring method.

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The Liquid Metal Age: A Transition From Hg to Ga

Handschuh‐Wang,

Wang,

Gancarz

et al. 2024

Advanced Materials

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This review offers an illuminating journey through the historical evolution and modern‐day applications of liquid metals, presenting a comprehensive view of their significance in diverse fields. Tracing the trajectory from mercury applications to contemporary innovations, the paper explores their pivotal role in industry and research. The analysis spans electrical switches, mechanical applications, electrodes, chemical synthesis, energy storage, thermal transport, electronics, and biomedicine. Each section examines the intricacies of liquid metal integration, elucidating their contributions to technological advancements and societal progress. Moreover, the review critically appraises the challenges and prospects inherent in liquid metal applications, addressing issues of recycling, corrosion management, device stability, economic feasibility, translational hurdles, and market dynamics. By delving into these complexities, the paper advances scholarly understanding and offers actionable insights for researchers, engineers, and policymakers. It aims to catalyze innovation, foster interdisciplinary collaboration, and promote liquid metal‐enabled solutions for societal needs. Through its comprehensive analysis and forward‐looking perspective, this review serves as a guide for navigating the landscape of liquid metal applications, bridging historical legacies with contemporary challenges, and highlighting the transformative potential of liquid metals in shaping future technologies.

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Chemical Reaction between Tantalum and Gallium under High Pressure

Cited by 4 publications

References 10 publications

Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond

Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond

Monitoring of Ga-Na melt electrical resistance and its correlation with crystal growth on the Na Flux method

The Liquid Metal Age: A Transition From Hg to Ga

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