Chemically Amplified Resist Approaches for E-beam Lithography Mask Fabrication

Maldonado, Juan R.; Angelopoulos, Marie; Huang, Wu‐Song; Brainard, Robert L.; Guevremont, Jeffrey M.; Tan, Zoilo C. H.

doi:10.1557/proc-705-y1.3

Cited by 1 publication

(1 citation statement)

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“…[67] Chemically amplified resists for e-beam lithography have attracted much attention and appear to be the future direction in this field due to reasons described above. [67][68][69][70][71][72] One example of the chemically amplified e-beam resists is the KRS series recently developed by IBM. [67][68][69] A low activation energy ketal protecting group was incorporated to address the PED stability that has been encountered in many chemically amplified resist systems, which allows the deprotection reaction to occur in situ during exposure under vacuum so that the system is insensitive to airborne contamination.…”

Section: Chemically Amplified E-beam Resistsmentioning

confidence: 99%

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

Yang

Dai

et al. 2005

SPIE Proceedings

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Lithography and the processes associated with it are the backbone of the nanotechnology revolution. Several developments are occurring simultaneously: a drive to reduce minimum feature size leading to advances in microelectronics, the use of lithographically patterned structures to prepare devices for photonics, biotechnology and other forms of nanotechnology and finally the drive to create three-dimensional (3D) structures for device and new materials creation. Thus the controlled formation of nanometer scale structures in two and three dimensions is of increasing interest in many applications. This paper will overview new approaches for the construction of small-scale structures using methods generally considered as next generation lithography. New approaches derived from two photon processes for the formation of complex images and the development of patterned structures will be described. Finally in the production of 3D patterns, the possible role of self-assembly coupled to lithography will be examined. Photodefinable block copolymers with erodable microstructures have been successfully used to form mesoporous materials and will be discussed.

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Section: Chemically Amplified E-beam Resistsmentioning

confidence: 99%