The Al-Ga intermixing at Al(Ga)N/GaN interfaces in nanowires and the chemical inhomogeneity in Al x Ga 1-x N/AlN nanodisks (NDs) are attributed to the strain relaxation process. This interpretation is supported by the three-dimensional strain distribution calculated by minimizing the elastic energy in the structure. The alloy inhomogeneity increases with Al content, leading to enhanced carrier localization signatures in their optical characteristics i.e. red shift of the emission, s-shaped temperature dependence and linewidth broadening. Despite these alloy fluctuations, the emission energy of AlGaN/AlN NDs can be tuned in the 240-350 nm range with internal quantum efficiencies around 30%.AlGaN/AlN quantum wells (QWs) 1 and quantum dots (QDs) 2,3, 4 have become promising active media for solid-state ultraviolet lighting. Nanodisks (NDs) in nanowires (NWs) have also emerged as alternative nanostructures which offer not only strong carrier localization 5,6 but also a possibility to improve photon extraction efficiency 7 . However, synthesis of ternary alloys in NWs generally suffers from strong chemical inhomogeneities 8 , which modify their electronic properties with respect to random alloys.Here, we present structural and optical studies of AlGaN sections and AlGaN/AlN NDs in NWs. In the case of AlGaN sections, alloy gradient and spontaneous chemical ordering were found along the wire axis, in addition to the formation of an Alrich shell. We found that alloy fluctuations increase in AlGaN sections with higher Al content, as evidenced by stronger carrier localization in their optical characteristics. At GaN/Al(Ga)N interfaces, we identify a transition zone with strong Al-Ga intermixing whose formation is attributed to the strain relaxation process. This interpretation is supported by a three-dimensional (3D) strain simulation. Despite the radial and axial alloy inhomogeneity, the photon emission energy of AlGaN/AlN NDs can be tuned by adjusting the nominal thickness and Al content.AlGaN sections and stacks of AlGaN/AlN NDs on GaN NWs were grown on Si (111) by plasma-assisted molecular beam epitaxy (PAMBE). Initially, a thin (~2 nm) AlN buffer layer 9 was grown at the substrate temperature T s = 840°C. Then, T s was decreased to 795 °C for the growth of GaN NWs using a Ga flux Φ Ga ~ 0.17 ML/s while the flux of active nitrogen was set at Φ N = 0.34 ML/s to maintain N-rich conditions. The deposition time of GaN NWs was t = 2.5 hours. Then, the Al x Ga 1-x N sections or the Al x Ga 1-x N/AlN NDs were synthesized on the top of these GaN NWs. The deposition time of AlGaN sections was 40 min, while that of AlGaN NDs was between 10 and 40 s with ~1 min AlN barriers. To adjust the nominal Al content (x = Φ Al /Φ N ) in the Al x Ga 1-x N, the Al flux was varied in the Φ Al = 0.07-0.17 ML/s range, while keeping Φ Ga = 0.09 ML/s and Φ N = 0.34 ML/s for the entire growth process. The Al, Ga and N deposition rates were calibrated by reflection high-energy electron diffraction intensity oscillations during the growth of two-di...