Pulsed laser deposition (PLD) is a relatively new and unique method for producing multicomponent thin films. PLD films are used in diverse areas such as microelectronics, electro-optics, tribology and biomaterials. The success of this technique is due to its simplicity and the ease with which stoichiometric multicomponent films can be deposited. Among the physical vapour deposition (PVD) techniques, PLD is unique because of its ability to work in high pressures of reactive background gases.Though in 1965, Smith and Turner 1 reported the pulsed laser deposition of dielectric films using a ruby laser for the first time, the technique had a rebirth after the pioneering work of the team led by Venkatesan, 2 who demonstrated that high temperature superconducting thin films of YBa 2 Cu 3 O 7 could be deposited using this technique. Following this report, the technique received renewed interest which accelerated the development of PLD to it current status. The present name, pulsed laser ablation was designated by official voting from the participants of the first Material Research Society Symposium on 'Pulsed laser ablation' held in San Francisco, CA, USA in April 1989. 3 Some of the developments and issues concerned with the PLD are discussed below. P. Kuppusami (left) V. S. Raghunathan (right)