Chemistry, Formulation, and Properties of Adhesives

Licari, James J.; Swanson, Dale W.

doi:10.1016/b978-1-4377-7889-2.10003-8

Cited by 23 publications

(20 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For the first step, the preparation of the PHU prepolymer (PHUdiCC) was carried out using an excess of PPGdiCC relative to the diamine, with a cyclic carbonate to amine molar ratio of 1/0.9 (Scheme ; first step). PPGdiCC was selected because PPG is one of the most commonly employed soft-segments in PU adhesives, as it provides good adhesion to different substrates and also presents good hydrolysis resistance and hydrophobicity . Priamine 1074 was used, as it is a commercially available biobased diamine, which also confers hydrophobicity to the materials .…”

Section: Resultsmentioning

confidence: 99%

“…PPGdiCC was selected because PPG is one of the most commonly employed softsegments in PU adhesives, as it provides good adhesion to different substrates and also presents good hydrolysis resistance and hydrophobicity. 32 Priamine 1074 was used, as it is a commercially available biobased diamine, which also confers hydrophobicity to the materials. 33 The reaction was carried out for 24 h without a catalyst and solvent.…”

Section: Synthesis Of Telechelic Triethoxysilane Phusmentioning

confidence: 99%

See 1 more Smart Citation

Monocomponent Non-isocyanate Polyurethane Adhesives Based on a Sol–Gel Process

Gomez-Lopez

Grignard

Calvo³

et al. 2020

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

Non-isocyanate polyurethanes (NIPUs) based on fivemembered cyclic carbonates have emerged as the most promising alternative to replace more toxic, conventional polyurethanes. However, the low reactivity of five-membered cyclic carbonates has limited the preparation of one pot systems because of long curing times. This work focuses on the improvement and application of these materials as adhesives through the combination of NIPU chemistry and a sol−gel process that allows for curing by atmospheric humidity. The synthesis of NIPU prepolymers functionalized with (3-aminopropyl)triethoxysilane (APTES) is demonstrated, and their curing behavior and adhesion performance are investigated by means of rheological experiments and a lap-shear test, respectively. In spite of the ability of the alkoxysilane to cure under ambient conditions, our results show that the use of catalyst and elevated temperatures speeds up the curing process and leads to improved adhesion properties. Hence, it is demonstrated that the fastest curing and the best performance are achieved at 100 °C when acetic acid is employed as the catalyst. Finally, we demonstrate the importance of the soft (poly(propylene glycol)dicarbonate) to hard (resorcinol dicarbonate) ratio to achieve superior cohesion and adhesion properties in NIPU adhesives.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Synthesis Of Telechelic Triethoxysilane Phusmentioning

confidence: 99%

Monocomponent Non-isocyanate Polyurethane Adhesives Based on a Sol–Gel Process

Gomez-Lopez

Grignard

Calvo³

et al. 2020

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

show abstract

“…The rotation speed and time of mixture were optimized in previous studies. The mixture was again degassed in a vacuum oven to remove remaining air bubbles and then poured into a cardboard mould with dimensions of 100×130×3 mm 3 . Finally, all nanocomposites produced with Sicomin resin were cured at room temperature for 24 hours and subjected to a post-cure at 40ºC for 24 hours, while those that were produced with Ebalta resin were cured at room temperature for 48 hours and subjected to a post-cure at 80ºC for 5 hours.…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

“…Diglycidyl ethers of bisphenol-F and/or bisphenol-A are the main elements of the most normal epoxy resins. Hardeners are curing agents that react with a resin and become part of the solid final epoxy through cross-linking chemical reaction when these two chemicals are mixed together [3]. These curing compounds can have different types of molecules such as amines, amideamines, anhydrides, carboxylic acids, polyamides or imidazoles.…”

Section: Introductionmentioning

confidence: 99%

Mechanical characterization of different epoxy resins enhanced with carbon nanofibers

Santos

Maceiras

Valvez

et al. 2020

Frattura Ed Integrità Strutturale

View full text Add to dashboard Cite

Epoxy with carbon nanofibers (CNFs) are effective nano enhanced materials that can be prepared by easy and low-cost method. The present paper compares the improvements, in terms of flexural and viscoelastic properties, of two epoxy resins reinforced with different weight percentages (wt.%) of CNFs. These epoxy resins have different viscosities, and weight contents between 0% and 1% of CNFs were used to achieve the maximum mechanical properties. Subsequently, for the best configurations obtained, the sensitivity to the strain rate and the viscoelastic behaviour (stress relaxation and creep) were analysed based on international standards. It was possible to conclude that, for both resins, carbon CNFs promote significant improvements in all the studied mechanical properties, even for different contents by weight.

show abstract

“…Metallic pastes deliver a desirable processing format for screen-printed conductors for electronic applications. − Such pastes are typically composed of conductive fillers, organic vehicles of both binders and solvents, inorganic binders, and additives such as dispersants to tune the overall paste functionality. ,− Accordingly, in order for these core–shell nanoparticles to be usable in realistic applications, further work is needed to formulate them into a suitable conductive paste. Thus, for the first time, we perform a systematic study to understand how organic vehicles in pastes synthesized following the procedure detailed in the Experimental Section mentioned below, including both organic binders and organic hardeners, affect the morphology and electrical and optical properties of printed conductors made out of copper–silver core–shell nanoparticles, aiming to deliver a cost-effective paste for potential printed-conductor applications.…”

Section: Resultsmentioning

confidence: 99%

Screen-Printable Cu–Ag Core–Shell Nanoparticle Paste for Reduced Silver Usage in Solar Cells: Particle Design, Paste Formulation, and Process Optimization

Deng

Subramanian

2022

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

Copper–silver (Cu–Ag) core–shell nanoparticles are promising for replacing the silver particles and flakes used in printed conductors in current solar cells since they deliver good conductivity, chemical stability, and optical performance, while also reducing the silver content, thus significantly impacting the cost. The bare nanoparticles offer excellent air stability thanks to the silver-covered copper structure. We demonstrate a screen-printable paste for use in solar cell conductor applications. We report a printed morphology and light reflection properties similar to those achieved with commercial silver pastes. The reported Cu–Ag core–shell paste is uniquely formulated with an epoxy binder and an aliphatic hardener, delivering significantly improved electrical conductivity, while simultaneously reducing the overall silver content by ∼36 wt %. This is attributable to the cross-linked polymeric structure, low-temperature conversion, and improved loading of conductive core–shell nanoparticles. As needed for contact formation in conventional top-contact silicon solar cells, the paste is additionally loaded with lead bisilicate and delivers conductivity on par with that of commercial silver paste. Thus, by combining the reduction of the silver content with excellent electronic and optical properties, this Cu–Ag nanoparticle-based paste becomes attractive for low-cost printed-conductor applications, including photovoltaics and electronics.

show abstract

Chemistry, Formulation, and Properties of Adhesives

Cited by 23 publications

References 16 publications

Monocomponent Non-isocyanate Polyurethane Adhesives Based on a Sol–Gel Process

Monocomponent Non-isocyanate Polyurethane Adhesives Based on a Sol–Gel Process

Mechanical characterization of different epoxy resins enhanced with carbon nanofibers

Screen-Printable Cu–Ag Core–Shell Nanoparticle Paste for Reduced Silver Usage in Solar Cells: Particle Design, Paste Formulation, and Process Optimization

Contact Info

Product

Resources

About