Chemistry in Interconnects

Low energy ion scattering (LEIS). A practical introduction to its theory, instrumentation, and applications

“…ALD is a coating method that can meet these demands, although sputtered barrier layers remain dominant in the industry. 52 In Stokhof and coworkers' study, WN X C Y was deposited by ALD over two different dielectric layers: SiO x , deposited by plasma enhanced chemical vapor deposition (PECVD), and Aurora® 2.7, a proprietary low-k dielectric. The thickness of the WN X C Y layer was controlled by varying the number of ALD cycles.…”