Chip on tape qualification and reliability

This paper describes an electronic assembly that uses SMT components, wire bonded chips as well as area array chips attached to a flexible carrier. The wire bond chip is reworkable until encapsulation.Heat spreaders are attached to flip chips and wire bond chips with thermally conductive adhesives. Volume constraints imposed by a system design can be satisfied by populating both sides of a flexible carrier with components. Potential cost savings and reliability gains are possible with this electronic assembly design replace multiple interconnection.A single flexible carrier with chips can printed circuit cards and two levels of

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Double sided flexible carrier with discretes and thermally enhanced FCA/COF

Milkovich¹,

Gaynes²,

Perkins³

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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Chip on tape qualification and reliability

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Double sided flexible carrier with discretes and thermally enhanced FCA/COF

Double sided flexible carrier with discretes and thermally enhanced FCA/COF

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