Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications

Torikka, T.; Duo, Xinzhong; Zheng, Lirong; Tjukanoff, E.; Tenhunen, Hannu

doi:10.1109/ectc.2004.1320343

Cited by 7 publications

(3 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Due to technical limitation, feature size of conductors are at 100-400um. In the second method, we use the same approach as our in-house developed SoP technology with embedded chip in LCP substrate [12][13][14][15][16]. This is a deposition and lithography based technology in which photo-BCB are coated via pin-off technique for interlayer conductor isolation and vias are etched for interlayer interconnection.…”

Section: B System Integration Issuesmentioning

confidence: 99%

Embedded smart systems for intelligent paper and packaging

Zheng

Shen

Duo

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Self Cite

View full text Add to dashboard Cite

In this paper, we present architecture, circuit implementation and integration issues of an embedded smart system for innovative, long-range interconnected identification/sensor network in warehouse and intelligent goods distribution systems. The network is interconnected via IEEE 802.11 and ultra-wideband (UWB) wireless air interfaces. A self-powered, ultra-low power UWB transceiver with BPSK modulation is designed for transponders and implemented in 0.18um CMOS technology. Low power consumption is achieved by developing innovative circuit and system architectures. Instead of pumping up energy from the Gaussian pluses emitted by the reader, a power converter draws energy from the 802.11 access point and its surrounding electromagnetic waves. Functionality of the transceiver is verified and integration issues for smart labels are investigated on thin foils of liquid crystal polymer.

show abstract

Section: B System Integration Issuesmentioning

confidence: 99%

Embedded smart systems for intelligent paper and packaging

Zheng

Shen

Duo

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Gain is found better than 10 dB and noise figure is less than 3.5 dB on the frequency range from DC to 13GHz. By adding some off-chip filters in SOP substrate, this wide-hand LNA can he easily re-configured as a concurrent multi-band radio [13]. Fig.15 is a layout of this multi-hand LNA on LCP in which the left part is two parallel band-pass filters for 2.4GHz and 5GHZ.…”

Section: Sop For Ultrawide Band Radiomentioning

confidence: 99%

Design and implementation of system-on-package for radio and mixed-signal applications

Zheng

Duo

Shen

et al.

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (

Self Cite

View full text Add to dashboard Cite

Emerging wireless applications for logistics, intelligent home networks, smart dusts, wireless body area networks (WBAN) will need integration and fusion of a diversity of technologies, which may include digital CMOS circuits, a n a l o m circuits, sensorsMEMS, embedded software and memories, antenna, displays, polymer, . packaging and interconnections, new materials and new integration process. System-on-package (SOP) is considered as a promising solution for the fundamental integration platform for such applications. In this paper, we show how SOP technology can address the integration platform for these applications and how this can be done in a better way than system-on-chip integration. We first demonstrate the integration process of, SOP in liquid-crystal polymer materials. We see that liquid-crystal-polymer is a promising material for low cost RF SOP. We then demonstrate some design examples. The fmt one is an integrated 5GHz RF receiver front-end in liquid crystal polymer. Due to high quality of passive components in SOP, superior RF performance is found in this module. In the second example, we address several critical design issues for on-chip versus off-chip passives in a multi-band multi-standard radio for beyond 3G applications. We find that not only RF performance can be improved. Cost benefits are also obvious for such a complex radio. Chip-package co-design for smart parasitic absorption is demonstrated through an RF module for an ultrawide band radio in gigabit wireless. Concept of a SOP pacemaker in a WBAN is shown. Finally, we discuss some system level integration issues and we show bow a system can be smartly partitioned for SOP so that we can obtain an optimal total solution for low-cost and good-performance wireless integration. IC ' E-mail: Irzhene~,imit.kth.se, Phone: +46-8-790 4104 0-7803-8620-5/04/$i7.00 02004 IEEE 97 Proceeding of HDP'04

show abstract

“…Nevertheless, only embedded passive technology has been reported and developed for RF systems in the form of individual RF building blocks while almost none of packaged RF transmitter system on a thin organic substrate has so far been reported [7][8][9][10][11][12][13][14][15]. This is especially true for the common consumer electronic circuits operating below gigahertz range.…”

Section: Introductionmentioning

confidence: 99%

Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate

Lam

Liu²,

Mui³

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

View full text Add to dashboard Cite

A 27-MHz wireless transmitter is fabricated with all the off-chip inductors, capacitors and resistors built on a thin organic substrate. The transmitter module occupies an area of 25mm×25mm. It includes the transistor circuits on a silicon chip and off-chip passive circuits with large-value inductors and capacitors. The newly packaged transmitter module functions properly and gives a 5 dB higher output power while other performances are comparable to that of the counterpart assembled using discrete passive components. It demonstrates the possible system-on-package (SOP) solution of radio-frequency (RF) systems using the embedded passives. IntroductionModern electronic systems have been driven toward further miniaturization and system integration with more functionality but keeping the total system cost and performance more or less the same or even better. This has been prevailing in wireless systems. As the silicon integrated circuit (IC) technology has been very mature in the implementation of digital and analog circuits, the system-onchip (SOC) has been considered as the solution of RF system integration [1]. However, there are passive components in RF circuits that cannot be integrated into the silicon IC chip. The passive components may be either too costly in terms of IC chip area or the RF performance is too poor.The passive components, primarily capacitors and inductors as well as resistors are key circuit elements in RF circuits of wireless systems. Although the discrete passives have been well developed and used to implement RF circuits on printed circuit board (PCB), they have drawbacks in terms of assembly and component counts. This is caused by the individual packages of the discrete passive components which are of bulky size and heavy weight. As a result, the packaging solution using discrete passives complicates the assembly and increases the volume and weight of the packaged systems. Furthermore, the system performance may also be compromised by the uncertain parasitic circuit elements associated with the leaded or SMT discrete passives.Although the system-on-package (SOP) has been considered as the solution of the system integration with optimized performance, including the wireless systems [2-6], few RF circuits using SOP approach have been reported. Nevertheless, only embedded passive technology has been reported and developed for RF systems in the form of individual RF building blocks while almost none of packaged RF transmitter system on a thin organic substrate has so far been reported [7][8][9][10][11][12][13][14][15]. This is especially true for the common consumer electronic circuits operating below gigahertz range.

show abstract

Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications

Cited by 7 publications

References 13 publications

Embedded smart systems for intelligent paper and packaging

Embedded smart systems for intelligent paper and packaging

Design and implementation of system-on-package for radio and mixed-signal applications

Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate

Contact Info

Product

Resources

About