2021
DOI: 10.31399/asm.cp.istfa2021p0269
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Chip Recombination Method in Planar Deprocessing – A Solution for Failure Analysis on Chip Edge Defects

Abstract: Planar deprocessing is a vital failure analysis (FA) technique for semiconductor chip reverse engineering. The basic concept of planar deprocessing is to remove all the “unnecessary” materials of a chip to expose an area of interest (AOI) and maintain the chip planarity and surface evenness. Finger deprocessing is one of the common techniques applied to this concept. This technique is essential in physical FA, especially for advanced bulk fin field-effect transistor (FinFET) devices. The success of finger depr… Show more

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