Chipless RFID based multi-sensor tag for printed electronics

Nadeem, Momina; Habib, Ayesha; Umair, Mir Yasir

doi:10.1016/j.heliyon.2024.e26494

Cited by 4 publications

(1 citation statement)

References 42 publications

(37 reference statements)

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“…Furthermore, when integrating chipless RFID sensors into real-world smart packaging, challenges such as a low cost, environmental robustness [17], compatibility and data security must be addressed effectively [18]. These barriers highlight the need for standardized solutions that can ensure reliable operation in different packaging environments while maintaining cost efficiency and accurate detection performance (e.g., high sensitivity), as well as addressing privacy issues to gain consumer confidence [19].…”

Section: Introductionmentioning

confidence: 99%

Applications of Chipless RFID Humidity Sensors to Smart Packaging Solutions

Mulloni,

Marchi,

Gaiardo

et al. 2024

Sensors

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Packaging solutions have recently evolved to become smart and intelligent thanks to technologies such as RFID tracking and communication systems, but the integration of sensing functionality in these systems is still under active development. In this paper, chipless RFID humidity sensors suitable for smart packaging are proposed together with a novel strategy to tune their performances and their operating range. The sensors are flexible, fast, low-cost and easy to fabricate and can be read wirelessly. The sensitivity and the humidity range where they can be used are adjustable by changing one of the sensor’s structural parameters. Moreover, these sensors are proposed as double parameter sensors, using both the frequency shift and the intensity variation of the resonance peak for the measure of the relative humidity. The results show that the sensitivity can vary remarkably among the sensors proposed, together with the operative range. The sensor suitability in two specific smart packaging applications is discussed. In the first case, a threshold sensor in the low-humidity range for package integrity verification is analyzed, and in the second case, a more complex measurement of humidity in non-hermetic packages is investigated. The discussion shows that the sensor configuration can easily be adapted to the different application needs.

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Section: Introductionmentioning

confidence: 99%

Applications of Chipless RFID Humidity Sensors to Smart Packaging Solutions

Mulloni,

Marchi,

Gaiardo

et al. 2024

Sensors

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Degradable and Printed Microstrip Line for Chipless Temperature and Humidity Sensing

Bourely,

Kim,

Beyer

et al. 2024

Adv Elect Materials

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Research on chipless and passive architectures for environmental sensing is generating high interest because they do not require any semiconductor components or batteries to operate, thus resulting in an eco‐friendlier footprint. This study demonstrates a printed microstrip line with multiple resonators using biodegradable materials to continuously monitor temperature and relative humidity (RH). Constructed with a paper substrate and printed zinc conductive lines, and encapsulated with beeswax to protect against the interference of humidity, the microstrip line integrates spiral‐shaped resonators. One resonator operates at 1.2 GHz for temperature sensing, while another, coated with konjac glucomannan serves for relative humidity sensing at 2 GHz. The multi‐resonating features allow for a simultaneous assessment of temperature and humidity. The microstrip line displays a linear sensitivity to temperature of −1.35 MHz °C−1 and a non‐linear relative humidity sensitivity ranging between −0.8 and −8 MHz/%RH from 30% to 70% RH. Its degradation in a lab‐made compost for 70 days shows the removal of the transducing layer in 7 days and degradation of the cellulosic substrate starting after 5 weeks. The developed environmental sensing devices are notably promising for future applications in smart packaging and the tracking of goods aiming at the minimization of electronic waste.

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An RFID smart structure using inkjet-printed additive manufacturing technology for metal crack characterization

Xie,

Wang,

Dong

et al. 2024

Smart Mater. Struct.

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Developing an indicator for metal materials to characterize cracks is urgent. However, traditional sensor-based technology has drawbacks such as high costs for installation and maintenance when using wired connections. In this paper, we studied the Radio Frequency Identification (RFID) sensors created through 3D printing technology to characterize surface cracks in metals, this approach simplifies the manufacturing process, silver nanoparticles are printed layer by layer on substrate to form the sensor pattern. The functionality of the sensor is verified through simulations and experiments involving samples with various crack sizes. Our findings demonstrate that when cracks pass over the sensor, there is a distinct response in terms of a shift in resonant frequency, moreover, the sensor offers a reading range greater than 0.7 m at resonance frequency without requiring power supply or wired connection for data transmission purposes. This research showcases the design of a smart structure that is compact, easy-to-fabricate, and potential for applications related to structural health monitoring (SHM) and crack sensing.

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Chipless RFID based multi-sensor tag for printed electronics

Cited by 4 publications

References 42 publications

Applications of Chipless RFID Humidity Sensors to Smart Packaging Solutions

Applications of Chipless RFID Humidity Sensors to Smart Packaging Solutions

Degradable and Printed Microstrip Line for Chipless Temperature and Humidity Sensing

An RFID smart structure using inkjet-printed additive manufacturing technology for metal crack characterization

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