2019
DOI: 10.1088/1361-6641/aafeb2
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Chlorine-based inductive coupled plasma etching ofα-Ga2O3

Abstract: Dry etching behavior of unintentionally-doped α-Ga 2 O 3 was investigated in a BCl 3 /Cl 2 /Ar chemistry using inductively-coupled-plasma technique. We systematically studied the impact of various etch conditions such as BCl 3 /Cl 2 /Ar gas ratio, plasma and bias powers, and chamber pressure on etch rate, surface roughness and mask selectivity of α-Ga 2 O 3 with respect to Si 3 N 4 , SiO 2 and photoresist. In contrast to GaN etching, Cl 2 was found to be far less effective than BCl 3 in etching α-Ga 2 O 3 .

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Cited by 19 publications
(12 citation statements)
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“…All the four samples were then solvent-cleaned with acetone, isopropyl alcohol, and methanol and blown dry with a N 2 gun. To remove the top ∼50 nm and expose the heavily doped region, a BCl 3 -based inductively coupled plasma reactive ion etch (ICP-RIE) was applied to samples C and D. , To identify the effect of this RIE process on contact performance independent of the Si-ion implant, sample B underwent the same dry etching process. All four samples were then processed with conventional photolithography to define the circular transmission line model (CTLM) structures.…”
Section: Methodsmentioning
confidence: 99%
“…All the four samples were then solvent-cleaned with acetone, isopropyl alcohol, and methanol and blown dry with a N 2 gun. To remove the top ∼50 nm and expose the heavily doped region, a BCl 3 -based inductively coupled plasma reactive ion etch (ICP-RIE) was applied to samples C and D. , To identify the effect of this RIE process on contact performance independent of the Si-ion implant, sample B underwent the same dry etching process. All four samples were then processed with conventional photolithography to define the circular transmission line model (CTLM) structures.…”
Section: Methodsmentioning
confidence: 99%
“…25 The root mean squared (RMS) roughness of the α-Ga 2 O 3 surface was observed to increase by 2.8 nm per 100 nm of etching, which is similar to the roughness change observed during conventional plasma etching (ICP). 13…”
Section: Resultsmentioning
confidence: 99%
“…Conventional lift-off photolithography was used to define CTLM structures on top of the epi-substrates. BCl 3 -based ICP-RIE operated at a bias power of 100 W , was performed on sample II prior to the metal deposition. This removes ∼50 nm of the top layer.…”
Section: Methodsmentioning
confidence: 99%