Chlorine resistance of tannic acid anticorrosive coating on galvanized steel in simulated concrete pore solution

Hou, Chen; Wang, Qing; Song, Wenhao; Xu, Shuping; Li, Zhe; Zhuo, XD

doi:10.1016/j.conbuildmat.2023.132657

Cited by 4 publications

(1 citation statement)

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“…Tannic acid (TA), as an all-natural organic compound, possesses excellent antioxidant properties. − More importantly, thanks to its unique chemical structure, TA can form molecular self-assembled membranes with a variety of metal ions by complexation, − thus achieving surface functionalization. Herein, based on our previous work on surface functionalization, − we first activated the carbon fiber (CF) powders surface through biomimetic poly(catechol/polyamines) (PCPA), followed by the surface metallization via electroless silver-plating to obtain a highly conductive silver-plated CF (Ag/pCF) filler.…”

Section: Introductionmentioning

confidence: 99%

Preparation of AntiSalt Spray Conductive Silver-Plated Carbon Fiber via Tannic Acid/Metal Ion Complex Inhibitors for Electromagnetic Interference Shielding

Shao,

He,

Chen

et al. 2024

Ind. Eng. Chem. Res.

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Conductive fillers are critical raw materials for many applications. However, vulnerability to salt spray corrosion remains the biggest problem for silver-plated conductive fillers. Herein, highly conductive silver-plated carbon fiber powders (Ag/pCF) were prepared via catechol/polyamine activation and subsequently formed a tannic acid/metal ion (TA@Me) complex inhibition layer. The electromagnetic interference (EMI) shielding effectiveness of the composite fabricated with original Ag/pCF decreased from 106.4 to 90.4 dB after a 4-cycle salt spray corrosion test, while the composites protected by TA@Me remained unchanged above 110 dB. Further research revealed that TA@Me could effectively block the penetration of Cl − , which is the primary corrosive chemical in a salt fog environment. Considering the high conductivity and the excellent antisalt spray performance, the Ag/pCF protected by the efficient TA@Me inhibition layer via an eco-friendly approach will be a priority alternative for high-performance EMIshielding applications.

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