2017
DOI: 10.1038/s41598-017-14915-7
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Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Abstract: In order to explore the possibility of using carbon nanotube (CNT) to introduce and control the temperature coefficient of resistance (TCR) of metal matrix composite, relatively thick and short multi-walled CNTs (MWCNTs) were introduced in the metal matrix with in-situ formation of chromium carbide (Cr7C3) at the CNT/copper (Cu) interface. We demonstrate that incompatible properties such as electrical conductivity and TCR can be achieved simultaneously by introducing MWCNTs in the Cu matrix, with control of th… Show more

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Cited by 16 publications
(9 citation statements)
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“…The stabilization occurs at the expense of dislocations, grain boundary nucleation, crack initiation, and propagation. In the case of CNT/Al composites, it is reported that the interfacial reaction between Al and CNTs is spontaneous with the formation of carbides (Al 4 C 3 ) . The TEM images of Al 4 C 3 are shown in Figure along with the defect in the carbide (white arrow in Figure a which shows poor interfacial bonding.…”
Section: Interface Mechanismsmentioning
confidence: 98%
See 1 more Smart Citation
“…The stabilization occurs at the expense of dislocations, grain boundary nucleation, crack initiation, and propagation. In the case of CNT/Al composites, it is reported that the interfacial reaction between Al and CNTs is spontaneous with the formation of carbides (Al 4 C 3 ) . The TEM images of Al 4 C 3 are shown in Figure along with the defect in the carbide (white arrow in Figure a which shows poor interfacial bonding.…”
Section: Interface Mechanismsmentioning
confidence: 98%
“…In the case of CNT/Al composites, it is reported that the interfacial reaction between Al and CNTs is spontaneous with the formation of carbides (Al 4 C 3 ). [129] The TEM images of Al C 3 are shown in Figure 6 along with the defect in the carbide (white arrow in Figure 6a which shows poor interfacial bonding. The selected area electron diffraction (SAED) pattern, which is generally difficult to obtain for CNTs, confirmed the presence of Al 4 C 3 in the inset of Figure 6a.…”
Section: Interface Mechanismsmentioning
confidence: 99%
“…However, recent simulations by Lee et al (2018) suggest that the decrease in electromigration of CNT-Cu is not related to changes in activation energy, but can be attributed to reduced self-heating of the composite when compared with pure Cu. The TCR of CNT-Cu can also be decreased considerably when compared with pure Cu, for both CNTs inside a Cu matrix (Subramaniam et al, 2013;Cho et al, 2017;Sundaram et al, 2017a) and for CNT material coated with a Cu cladding (Sun et al, 2016;Zou et al, 2018). This enhancement shows potential for possible high temperature applications of CNT-Cu.…”
Section: Electrical and Thermal Properties Of Cnt-cu Compositesmentioning
confidence: 94%
“…Typically, Leggiero et al found that the seeded Cu using the CVD method and electrodeposited with CNT achieved excellent conductors [34]. Cho et al explored CNT and metal matrix composite-compounded chromium carbide by in situ formation, which achieved incompatible properties including electrical conductivity and temperature coefficient of resistance [35].…”
Section: Introductionmentioning
confidence: 99%