Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy

Gumaan, Mohammed S.

doi:10.1007/s10854-020-03623-0

Cited by 19 publications

(15 citation statements)

References 16 publications

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“…This time contraction is attributed to the increased force per unit area, thus atomic bonding, leading to the unbalancing energy in the system that leads to the rupture rapidly. Comparison among fig 4 a, b, c, d, e and f indicates to prolonged rupture time with adding 0.3 and 0.5 wt.% of Bi to the eutectic Sn-Cu alloy with both 18.7 and 21.2 MPa loads with all different temperatures as shown in Table (2). The rupture time improvements with these additions are strongly related to the refined particle size of β-Sn (table 1) [23] [24].…”

Section: Mechanical and Creep Behaviormentioning

confidence: 97%

“…Bi atoms function through the solidification process as barriers to β-Sn formation, which leads to the β-Sn reduction. It is clear that, as shown in Table 1, the cell volumes for all as-cast alloys have been reduced with Bi additions the lattice distortions were calculated according to G. K. Williamson and W. H. Hall [19]: (2) where Deff is the size of the crystallite in the β-Sn matrix and ε is a local lattice distortion.…”

Section: Structural Analysismentioning

confidence: 99%

“…Lead-free solder alloys are typically Sn-based alloys due to the high corrosion resistance and good solderability of tin (Sn) [1]. Solder alloys based on the eutectic Sn-Ag and Sn-Cu alloy systems have been found to be amongst the most favorable leadfree alternatives [2][3] [4] [5][6] [7]. Although the Sn-Ag and Sn-Ag-Cu solders are the most widely studied solder systems because of their high strength, creep resistance, and excellent machinability.…”

Section: Introductionmentioning

confidence: 99%

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Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Alsowidy

Aljarbani

Gumaan

2021

Preprint

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The microstructural, creep resistance and electrical conductivity properties of Sn-0.7Cu eutectic alloy with Bi-additions in concentrations (0.3 and 0.5 wt.%) have been investigated using x-ray diffraction (XRD), Scanning electron microscope (SEM), creep testing machine and (DC) circuit respectively. The three samples were prepared from high purity (99.99%) elements Sn, Cu, and Bi using melting technique. XRD and SEM analysis showed that the eutectic Sn-0.7Cu alloy composed primarily of two phases; a body centered tetragonal 𝜷-Sn phase and monoclinic IMC Cu 6 Sn 5 , the additions of 0.3 and 0.5 wt.% Bi to the eutectic Sn-0.7Cu promote the formation of IMC Cu 6 Sn 5. The above motioned Bi additions have refined the 𝜷-Sn particle size. Creep tests showed that the creep strain rate increases and the creep lifetime (rupture time) decreases as the applied stress and temperature rises. Improvements in creep resistance solders have been achieved by increasing the Bi content up to 0.5 wt. %. The mean values of stress exponent and activation energy indicate that the dislocation creep is the dominate controlling mechanism. The electrical conductivity of the samples was calculated at room temperature, it has the highest value with 0.3 wt.% of Bi.

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Section: Mechanical and Creep Behaviormentioning

confidence: 97%

Section: Structural Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Alsowidy

Aljarbani

Gumaan

2021

Preprint

Self Cite

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“…Where a is the lattice constant obtained from the XRD measurements. Different elastic parameters can be calculated as [27][28][29][30][31][32]:…”

Section: Fourier-transform Infrared (Ftir) Spectroscopymentioning

confidence: 99%

The structure, and magnetic properties of NiR0.05Fe1.95O4 (rare earth R=Sm, Gd): Effect of Thermal Neutron Radiation

Roumaih

Elbahrawy

Ismail

2021

Arab Journal of Nuclear Sciences and Applications

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“…Furthermore, with the miniaturization of solder joints and deterioration of serving environment (radiation condition, corrosive environment, and drop impact), many measures had been taken to improve the properties of Sn-based lead-free solder alloys [6,7]. Consequently, trace amount of alloying elements (Ni [8][9][10], Mn [11], Bi [12], Co [13,14], Cr [15], Al [9], Sb [10], Fe [16], and rare earth (RE) [17,18]) is incorporated with Sn-based lead-free solder to enhance the comprehensive properties. Moreover, with the popularity and utilization of nanometer materials fabricating technology, the nanometer particles are doped with Sn-based lead-free solder to improve the comprehensive properties, such as nanometer oxide (Al 2 O 3 [19][20][21], BaTiO 3 [22], Y 2 O 3 [23], TiO 2 [24][25][26][27], and ZrO 2 [28,29]), nanometer carbide ( [30,31]), nanometer IMC (Cu 6 Sn 5 [32][33][34]), and carbon-based nanometer materials (carbon nanotubes (CNTs) [35][36][37], graphene [38][39][40], and fullerenes [41][42][43]).…”

Section: Introductionmentioning

confidence: 99%

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Wang

Liu

et al. 2020

Journal of Nanomaterials

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With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

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Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy

Cited by 19 publications

References 16 publications

Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

The structure, and magnetic properties of NiR0.05Fe1.95O4 (rare earth R=Sm, Gd): Effect of Thermal Neutron Radiation

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

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