ABSTRACT:In this study the removal of Cu(II) ions from aqueous solution was performed at different concentrations, temperatures, and pHs using ethanol-based organosolv lignin as the adsorbent. The results indicated that the amount of Cu(II) ions adsorbed onto the lignin increased with increasing concentration and pH; however, it decreased with an increase in temperature. It was possible to remove 40.74% (maximum removal) of Cu(II) ions from aqueous solution by using organosolv lignin within 10 min under certain conditions (3 ϫ 10 Ϫ4 M and 20°C). The adsorption process was determined to be consistent with the Freundlich isotherm. Furthermore, it was found that 40% (maximum recovery) of the Cu(II) ions adsorbed on the organosolv lignin could be recovered using HCl with an initial concentration of 3 ϫ 10 Ϫ4 M and a contact time of 10 min.