2022
DOI: 10.1007/s12200-022-00013-8
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Circuit-level convergence of electronics and photonics: basic concepts and recent advances

Abstract: Integrated photonics is widely regarded as an important post-Moore’s law research direction. However, it suffers from intrinsic limitations, such as lack of control and satisfactory photonic memory, that cannot be solved in the optical domain and must be combined with electronics for practical use. Inevitably, electronics and photonics will converge. The photonic fabrication and integration technology is gradually maturing and electronics-photonics convergence (EPC) is experiencing a transition from device int… Show more

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Cited by 12 publications
(4 citation statements)
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“…Finally, factors like scalability, reconfigurability, and sensitivity to fabrication imperfections can influence the choice between PICs and ASICs [87].…”
Section: Usage Of the Complexity Metrics In Photonic Hardwarementioning
confidence: 99%
“…Finally, factors like scalability, reconfigurability, and sensitivity to fabrication imperfections can influence the choice between PICs and ASICs [87].…”
Section: Usage Of the Complexity Metrics In Photonic Hardwarementioning
confidence: 99%
“…Electronic-photonic heterogeneous-converging integrated circuits (EPHICs) are widely accepted as a promising technology in the post-Moore era [1,2]. By sufficiently combining the strengths of EICs and PICs, many impending challenges in different fields, such as data transmission and processing, are expected to be addressed.…”
Section: Introductionmentioning
confidence: 99%
“…[31,32] Further optical integration of the lasing microelement on a chip would require the assembly of a photonic circuit with an outcoupling waveguide. [16,33,34] The first attempt to integrate a metal halide perovskite laser onto a photonic chip was made by Cegielski et al [34] In that study, a Si 3 N 4 waveguide and a metal halide perovskite racetrack microresonator were integrated into a Si/SiO 2 substrate. The chip was fabricated using conventional optical lithography combined with low-pressure chemical vapor deposition, and spin coating was conducted to fill the trenches with functional layers.…”
Section: Introductionmentioning
confidence: 99%
“…Further optical integration of the lasing microelement on a chip would require the assembly of a photonic circuit with an outcoupling waveguide. [ 16,33,34 ] The first attempt to integrate a metal halide perovskite laser onto a photonic chip was made by Cegielski et al. [ 34 ] In that study, a Si 3 N 4 waveguide and a metal halide perovskite racetrack microresonator were integrated into a Si/SiO 2 substrate.…”
Section: Introductionmentioning
confidence: 99%