Cleaning of patterned porous low-k dielectrics with water, carbon dioxide and ambidextrous surfactants

Keagy, John A.; Zhang, Xiaogang; Johnston, Keith P.; Busch, Eric; Weber, Frank; Wolf, Peter; Rhoad, Todd

doi:10.1016/j.supflu.2006.04.009

Cited by 39 publications

(31 citation statements)

References 34 publications

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“…Compressed CO 2 has been used in different fields, such as extraction and fractionation, [12] chemical reactions, [13] materials science, [14] microelectronics, [15] and for the control over the stability of micelles [16] that inhibit the precipitation of surfactants in vesicular systems, [17] the induction of nanoemulsions, [18] the transition between liquid crystals and micelles, [19] the creation of micro-…”

Section: Introductionmentioning

confidence: 99%

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Zhang

Zhao

et al. 2010

Chemistry A European J

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The study of the micelle-to-vesicle transition (MVT) is of great importance from both theoretical and practical points of view. Herein, we studied the effect of compressed CO(2) on the aggregation behavior of dodecyltrimethylammonium bromide (DTAB)/sodium dodecyl sulfate (SDS) mixed surfactants in aqueous solution by means of direct observation, turbidity and conductivity measurements, steady-state fluorescence, time-resolved fluorescence quenching (TRFQ), fluorescence quantum yield, and template methods. Interestingly, all these approaches showed that compressed CO(2) could induce the MVT in the surfactant system, and the vesicles returned to the micelles simply by depressurization; that is, CO(2) can be used to switch the MVT reversibly by controlling pressure. Some other gases, such as methane, ethylene, and ethane, could also induce the MVT of the surfactant solution. A possible mechanism is proposed on the basis of the packing-parameter theory and thermodynamic principles. It is shown that the mechanism of the MVT induced by a nonpolar gas is different from the MVT induced by polar and electrolyte additives.

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Section: Introductionmentioning

confidence: 99%

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Zhang

Zhao

et al. 2010

Chemistry A European J

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“…Eqs. (6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16) were used to calculate the static forces of a particle on substrate under different pressures and temperatures. The solution of them employed Mathematica to obtain a series of data.…”

Section: Capillary Pressure Effect Forcementioning

confidence: 99%

“…The numerous designs of dense CO 2 cleaning and drying systems in semiconductor processing have been described previously [7][8][9][10][11][12]. Few of these studies focused on the microscopic behavior and physics models of particle removing in dense gas solvent.…”

Section: Introductionmentioning

confidence: 99%

Microscopic model of nano-scale particles removal in high pressure CO2-based solvents

Chai

Zhang

Huang

et al. 2009

The Journal of Supercritical Fluids

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a b s t r a c tA physical model is presented to describe the kinds of static forces responsible for adhesion of nano-scale copper metal particles to silicon surface with a fluid layer. To demonstrate the extent of particle cleaning, equilibrium separation distance (ESD) and net adhesion force (NAF) of a regulated metal particle with different radii (10-300 nm) on the silicon surface in CO 2 -based cleaning systems under different pressures were simulated. Generally, increasing the pressure of the cleaning system decreased the net adhesion force between spherical copper particle and silicon surface entrapped with medium. For CO 2 + isopropanol cleaning system, the equilibrium separation distance exhibited a maximum at temperature 313.15 K in the regions of pressure space (1.84-8.02 MPa). When the dimension of copper particle was given, for example, 50 nm radius particles, the net adhesion force decreased and equilibrium separation distance increased with increased pressure in the CO 2 + H 2 O cleaning system at temperature 348.15 K under 2.50-12.67 MPa pressure range. However, the net adhesion force and equilibrium separation distance both decreased with an increase in surfactant concentration at given pressure (27.6 or 27.5 MPa) and temperature (318 or 298 K) for CO 2 + H 2 O with surfactant PFPE COO − NH 4 + or DiF 8 -PO 4 − Na + .

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“…Thus, the cores of the aggregates are not able to dissolve or suspend a significant amount of residues. Even if the microemulsion composed of 1 wt% TMN-6 (5b-C12E8) and 1 wt% water in CO2 prepared at 408C and 20.6 MPa, which is expected enhance the removal of residues, is insufficient to get highly cleaning effect despite wafer position, i. e., upwards or downwards, suggesting that gravity has no effect on the removal of residues and the microemulsion droplets do not have enough contact with the wafers for displacement of the residues from the surfaces by detergency mechanisms [55]. Another possibility is that the microemulsion cleaning system can disengage the particles from the surface; however, the particles cannot be lifted out of the bottom trench.…”

Section: Applications Of Co 2 -Based Solvent Cleaningmentioning

confidence: 99%

Cleaning Using CO₂‐Based Solvents

Zhang¹,

Han

2007

CLEAN Soil Air Water

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Cleaning with hierarchy of CO 2 -based solvents is advantageous from an environmental point of view because CO 2 is non-flammable, virtually inert, and abundant. After cleaning, the only waste stuffs generated are the contaminants that are removed from the cleaned parts. The technology is especially well suited for precision cleaning applications in which parts have intricate geometries or for applications in which parts are sensitive to water or high temperature. This review will first introduce aqueous cleaning concepts and mechanism, which is helpful to understand how to design cleaning systems using high pressure CO 2 . Recent microelectronic processes for cleaning and rising of circuit wafers using CO 2 -based solvents are the main focus of the review. Additional cleaning topics include dry cleaning, separation of dyestuffs, and extraction of contaminations from soils and regeneration of catalysts.

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Cleaning of patterned porous low-k dielectrics with water, carbon dioxide and ambidextrous surfactants

Cited by 39 publications

References 34 publications

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Microscopic model of nano-scale particles removal in high pressure CO2-based solvents

Cleaning Using CO₂‐Based Solvents

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Cleaning of patterned porous low-k dielectrics with water, carbon dioxide and ambidextrous surfactants

Cited by 39 publications

References 34 publications

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO2

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO2

Microscopic model of nano-scale particles removal in high pressure CO2-based solvents

Cleaning Using CO2‐Based Solvents

Contact Info

Product

Resources

About

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Reversible Switching of a Micelle‐to‐Vesicle Transition by Compressed CO₂

Cleaning Using CO₂‐Based Solvents