CMOS-integrated silicon 3d force sensor system for micro component coordinate measurement machines

Levey, B.; Gieschke, P.; Doelle, M.; Trautmann, Alain; Ruther, Patrick; Oliver, Paul

doi:10.1109/memsys.2007.4433081

Cited by 9 publications

(5 citation statements)

References 5 publications

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“…Silicon based piezoresistive sensors, as demonstrated in the literature [9,10,14,28,29,31], providing a compact system size and a minimal moving mass, perfectly fulfill these requirements. They comprise a central structure suspended within a solid frame.…”

Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 91%

“…They comprise a central structure suspended within a solid frame. The flexible suspension has been achieved using multiple beams [28], a thin membrane with a stiffening boss structure [9,29], and membrane hinges [10,14,31]. The application of lateral and vertical forces to the probing sphere attached to the central part of the flexible structure using a probe pin results in characteristic deflections of these suspensions.…”

Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 99%

“…The deflections are monitored using piezoresistive stress sensing elements integrated in the beams, membrane, or membrane hinges. Depending on the used fabrication technology and sensor design, stress sensing elements such as p-well resistors [9,10,29], 4-terminal pwells or p-channel piezo-FETs [14,31] have been used. The tactile sensors are available as passive chips containing piezoresistive stress sensing elements without any integrated circuitry [9,10,28,29] or as integrated CMOS-based tactile sensor systems [14,31].…”

Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 99%

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CMOS tactile sensor systems

et al. 2013

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Tactile sensor systems based on complementary metal-oxide-semiconductor (CMOS) technologies have found a wide variety of applications covering various types of manmachine interfaces as well as industrial applications. These sensor systems are realized using commercially available CMOS processes combined with appropriate assembly technologies for advanced system packages, and dedicated micromachining processes to realize membranes or beam structures to improve the sensor sensitivity. Piezoresistive CMOS-based tactile sensor systems make use of implanted resistors and field-effect transistors (FETs) exploiting the piezoresistive effect in silicon. The applied CMOS chips extract the mechanical stress distribution in the chip surface which is characteristic for the corresponding mechanical loading of the CMOS chip or its package. This paper describes a three-dimensional force sensor used in metrology to extract the 3D geometry of precision machined parts, and the Smart Tooth, an innovative tool for orthodontic research and education.

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Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 91%

Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 99%

Section: A 3d Force Sensor For Coordinate Measurement Machinesmentioning

confidence: 99%

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CMOS tactile sensor systems

et al. 2013

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“…This will be demonstrated by measuring the compliance of the bistable switch over its entire range of motion with no gaps in the forcedisplacement curve. The instrument is also unique in achieving lower force resolution (≈ 1 μN) than most other instruments designed for MEMS metrology such as [8], [11], [26]- [29]. The conceptual design for the unique two-axis forcefeedback sensor of the interfacial force miscroscope developed here is described in the patent [30].…”

Section: Measurement Techniquementioning

confidence: 99%

Modeling and Measurement of a Bistable Beam in a Microelectromechanical System

Brake

Baker

Moore

et al. 2010

J. Microelectromech. Syst.

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Design and fabrication of microelectromechanical systems (MEMS) can be costly, time consuming, and necessitating accurate models for their behavior. Current theoretical models of bistable beams in MEMS devices are limited to numerical or small deformation models and current measurement techniques are unable to fully characterize these devices as they only determine thresholds or have resolutions that are too coarse to adequately explore the force-deflection relationship of bistable mechanisms. Two analytical models are developed: a stepped Euler-Bernoulli beam and a large deformation model. To validate these models, a new technique for measuring in-plane mechanical properties of MEMS devices is introduced that measures normal and lateral forces against a probe tip, while electrostatic actuation and a force-feedback loop maintain the desired tip position. This allows true displacement-controlled measurements along two axes and facilitates automated positioning. Measurements validate the large deformation model and show that Euler-Bernoulli beam theory is inadequate for modeling the mechanism's bistable behavior.A parameter study in edge width using the large deformation model accounts for discrepancies between predicted and measured forces. The model's utility is further demonstrated by an optimization study that redesigns the mechanism to be less sensitive to the edge width variation introduced in the manufacturing process.[ 2010-0026]Index Terms-Bistable mechanism, interfacial force microscopy, large deflection modeling, microelectromechanical systems.

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“…Figures 2a and b shows the conventional one boss full and cross membrane. To get comparable stiffness in the x, y and z directions many groups are concentrating on modifying the boss membrane design by using eight beams [ 10 ], twin membranes [ 11 ] and five boss cross membranes (CM) fabricated using dry etching [ 12 ].…”

Section: Membrane Designs For the Force Sensorsmentioning

confidence: 99%

Development of 3D Force Sensors for Nanopositioning and Nanomeasuring Machine

Tibrewala

Hofmann

Phataralaoha

et al. 2009

Sensors

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In this contribution, we report on different miniaturized bulk micro machined three-axes piezoresistive force sensors for nanopositioning and nanomeasuring machine (NPMM). Various boss membrane structures, such as one boss full/cross, five boss full/cross and swastika membranes, were used as a basic structure for the force sensors. All designs have 16 p-type diffused piezoresistors on the surface of the membrane. Sensitivities in x, y and z directions are measured. Simulated and measured stiffness ratio in horizontal to vertical direction is measured for each design. Effect of the length of the stylus on H:V stiffness ratio is studied. Minimum and maximum deflection and resonance frequency are measured for all designs. The sensors were placed in a nanopositioning and nanomeasuring machine and one point measurements were performed for all the designs. Lastly the application of the sensor is shown, where dimension of a cube is measured using the sensor.

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CMOS-integrated silicon 3d force sensor system for micro component coordinate measurement machines

Cited by 9 publications

References 5 publications

CMOS tactile sensor systems

CMOS tactile sensor systems

Modeling and Measurement of a Bistable Beam in a Microelectromechanical System

Development of 3D Force Sensors for Nanopositioning and Nanomeasuring Machine

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