2017
DOI: 10.1016/j.microrel.2017.05.031
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CMOS micro-heater design for direct integration of carbon nanotubes

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Cited by 11 publications
(9 citation statements)
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“…High thermal gradient around the micro-heaters is necessary for CMOS compatible temperature (< 300 o C) in the chip, which can mainly be accomplished by partially suspending the micro-heaters. Our simulation results support the achievability of such thermal requirements of the designed CMOS micro-heaters [8], [9]. AMS 0.35µm CMOS process has two polysilicon layers (Poly-1 & Poly-2) and uses aluminium (Al) for interconnecting metal layers [10].…”
Section: Introductionsupporting
confidence: 56%
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“…High thermal gradient around the micro-heaters is necessary for CMOS compatible temperature (< 300 o C) in the chip, which can mainly be accomplished by partially suspending the micro-heaters. Our simulation results support the achievability of such thermal requirements of the designed CMOS micro-heaters [8], [9]. AMS 0.35µm CMOS process has two polysilicon layers (Poly-1 & Poly-2) and uses aluminium (Al) for interconnecting metal layers [10].…”
Section: Introductionsupporting
confidence: 56%
“…Poly-2 layer has higher resistivity than Poly-1 layer. In terms of material properties, polysilicon is more suitable as a micro-heater than metal [8], [9]. Due to high electrical resistivity, polysilicon heaters can have very short length.…”
Section: B Polysilicon Micro-heatersmentioning
confidence: 99%
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“…In a previous study, we showed Cu–Ni alloy to be the best-suited microheater material among other Cu alloys [42]. It should be noted from Equation (1), microheater thickness square ( t 2 ) is inversely proportion to microheater temperature, and thickness of the microheater depends on the alloy composition.…”
Section: Design Approach For Cnt Growth Structures In Cmosmentioning
confidence: 99%
“…Therefore, the dissipated electrical power in resistive heating can be converted to heat by Fourier’s law of heat conduction. We have previously derived an equation for a rectangular heater [42], where the maximum temperature ( T ) at the center can be expressed as Equation (1):T=T0+I2l2ρ8w2t2k where T 0 is ambient temperature, I is the current through the microheater, ρ is electrical resistivity, k is thermal conductivity, and l , w , and t are length, width, and thickness of the microheater, respectively.…”
Section: Design Approach For Cnt Growth Structures In Cmosmentioning
confidence: 99%