1993
DOI: 10.1063/1.352502
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Co alloy media made on amorphous carbon substrate

Abstract: Co-based alloy media were made on recently developed ultra densified amorphous carbon (UDAC) substrates which have several advantages over NiP/Al, glass, and ceramics substrates. It was found that the coercivity (Hc) of media made on UDAC substrates was higher than that on NiP/Al substrates, as was the adhesion performance. The latter is a result of the formation of Cr–C compound at the interface.

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Cited by 15 publications
(2 citation statements)
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“…Figure 3 compares the surface morphology of superconducting films after thermal processing for 1 hour at 600 • C prepared without (figure 3(a)) and with (figure 3 layers (~6 × 10 −6 K −1 ) [23] and the glassy carbon substrate (3 × 10 −6 K −1 ) [22]. Upon heating, the Mg layer expands more than the surrounding B and C substrate layers [12], which could induce the blistering observed in unmixed films.…”
Section: Resultsmentioning
confidence: 99%
“…Figure 3 compares the surface morphology of superconducting films after thermal processing for 1 hour at 600 • C prepared without (figure 3(a)) and with (figure 3 layers (~6 × 10 −6 K −1 ) [23] and the glassy carbon substrate (3 × 10 −6 K −1 ) [22]. Upon heating, the Mg layer expands more than the surrounding B and C substrate layers [12], which could induce the blistering observed in unmixed films.…”
Section: Resultsmentioning
confidence: 99%
“…In contrast, the thinnest films (25 and 55 nm) do not exhibit blistering (figure 6(e)). Such blistering can be attributed to compressive stresses due to a difference in the coefficient of thermal expansion between glassy carbon (3 × 10 −6 K −1 ) [47] and B (∼6 × 10 −6 K −1 ) [48], presumably exacerbated by poor adhesion of the film. Furthermore, the nearly twofold increase in volume of the film during vapor processing likely imposes an upper limit on stable film thickness, irrespective of the stress related to thermal expansion.…”
Section: Film Thickness Dependencementioning
confidence: 99%