Co-design of flip chip interconnection with anisotropic conductive adhesives and inkjet-printed circuits for paper-based RFID tags

Abstract

Co-design of flip chip interconnection with anisotropic conductive adhesives and inkjet-printed circuits for paper-based RFID tags.In: 2011 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 1752-1757 AbstractIn this paper we study the radio frequency performance of interconnect using anisotropic conductive film (ACF). A series of experiments are conducted in order to measure and model the electrical characteristics of inkjet-printed circuits on paper substrate as well as the impedance parameters of ACF interconnect at high frequency. Four-point measurement structure, time domain reflectometry (TDR), vector network analyzer (VNA) and de-embedded technology are used to ensure the accuracy of experiments. Equivalent circuit models are built based on the experimental results. Finally, these models are considered as parts of the matching network and circuit design for the RFID receiver, which can be co-designed for developing paper-based electronic systems. It is found that since the difference between RFID tags with and without ACF interconnects is negligible, the influence of ACF interconnects can be ignored for paper-based UHF RFID tag. ACF is a feasible interconnect material for paper-based RFID tags.

Digital Fabrication and Integration of a Flexible Wireless Sensing Device

“…The packaged chip has surface-mount pads in a plastic quad-flat no-leads carrier, with a pad size of 400 μm by 355 μm and pad-to-pad spacing of 800 μm. This type of package can be readily mounted on the flexible substrate using anisotropic conductive film (ACF), with a proper temperature and pressure (Fig 8 (a)) [23], [24]. The bare-die(unpackaged) version offers a smaller form factor and, especially if thinned, enhanced mechanical flexibility of the resulting device [25].…”