Co-design optimization of laminate substrates for high speed applications

Araujo, D.N. de; Cases, M.; Pham, N.; Matoglu, E.

doi:10.1109/ectc.2004.1320359

Cited by 4 publications

(2 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Crosstalk, on the other hand, can cause severe signal loss due to the proximity of the aggressors to the receivers in a package. A greater than 40 dB of isolation in the package design was obtained through optimized breakout and routing of transmit and receive signals [12]. Given the complexity of the design, a rules driven approach was used to guarantee routing and spacing isolation requirements throughout the design.…”

Section: Reflections and Crosstalkmentioning

confidence: 99%

Complex high speed links in server environments

Araujo

Matoglu

Cases

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Self Cite

View full text Add to dashboard Cite

Complex interconnects for server links pose a design challenge due to many components, interactions and tradeoffs. This paper examines the evolution, design choices, current challenges, and future directions of such high speed links in a scalable server setting. I. IntroductionAs performance requirements for high-end servers increase, designers are faced with systems\ demands for high speed links to provide data transport within and across computation nodes for increased bandwidth. As new technologies such as hyper-threading and multi-core processors become more prevalent, this places even higher demands on the signaling and interconnect. Despite high losses and interconnect type transitions, the speed and range of copper electrical links have been continuously extended due to innovative designs. A careful balance and tradeoff between cost and performance at every level is needed to stay competitive in the high performance, high volume server market.While most standards for high speed links have provisions for simpler topologies such as agent to agent on the same board, across boards through a connector, in a backplane environment with two connectors, or in a simple cabled configuration [1], more complex topologies are rarely covered due to the vast number of design tradeoffs and interoperability issues. In Section II, this paper examines the evolution of high speed scalability link. Electrical signaling is covered in section III, followed by a description of the complex internal/external topologies in Section IV. Link design challenges are examined in Section V. While Section VI covers modeling and simulation, Section VII addresses testing and validation. Future directions are discussed in section VIII and results are summarized in Section IX.

show abstract

Section: Reflections and Crosstalkmentioning

confidence: 99%

Complex high speed links in server environments

Araujo

Matoglu

Cases

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Self Cite

View full text Add to dashboard Cite

show abstract

“…While cost can be optimized with maximum wiring escape, wiring capability pertains to electrical performance in high speed applications. [1,2] As coupling noise limits onto sensitive high speed signals are imposed to secure product performance, higher isolation requires larger design space and potentially large figure of packages which can increase packaging cost, whereas smaller package figures are sought for high integration level of system as well. This becomes more debating an issue in cost-performance as the application data rates jump up to a higher end.…”

Section: Introductionmentioning

confidence: 99%

Design Optimization for Isolation in High Wiring Density Packages with High Speed SerDes Links

Audet²,

Shan³

et al.

56th Electronic Components and Technology Conference 2006

View full text Add to dashboard Cite

This paper discusses design tradeoffs for high speed signal performance in buildup laminate packages with high wiring density. Trace design in die escaping area, PTH vias placement pattern and BGA I/O assignments are analyzed in depth for design optimization through numerous simulations as major areas of high coupling concern and channel performance. Then design suggestions are made at each area for performance and cost optimization and design strategies are developed to achieve the overall required performance as a whole system. Lastly some coupling test results on HSS links are presented to verify the performance of the design.

show abstract