Co-evaporated YBCO/doped-CeO2/Ni–W coated conductors oxygen improved using a supersonic nozzle

Sm-doped CeO2 single buffer layer for YBCO coated conductors by polymer assisted chemical solution deposition (PACSD) method

“…The critical thickness of RE 2 O 3 (RE = Sm, Eu and other lanthanides) thin films via a solution approach has been reported to be over 100 nm [24], which is far superior relative to that of CeO 2 . Given the similar chemical properties between Ce and RE, the solubility of some RE 2 O 3 in CeO 2 can reach up to 50%, for example, Sm 0.4 Ce 0.6 O 1.8−x and Gd 0.4 Ce 0.6 O 1.8−x powder has been obtained by Brauer and Gradinger [25], Yb 0.45 Ce 0.55 O 1.775−x has been proposed by Gilioli et al [26] and Y 0.5 Ce 0.5 O 1.5−x by Shi et al [27]. This demonstrates that it may be possible to improve the critical thickness of CeO 2 based thin solid film without crack generation.…”

“…Zeng et al [28] has recently reported a 800 nm-thick Sm-doped CeO 2 (cation ratio Sm:Ce = 1:4) single buffer layer on NiW via MOCVD approach, on which YBCO film has been deposited with J c (77 K, 0 T) = 0.5 MA/cm 2 . Gilioli et al [26] has succeeded in the preparation of an over 200 nm thick Yb 0.45 Ce 0.55 O 1.775−x by an E-beam evaporation technique with a J c (77 K, 0 T) = 0.9 MA/cm 2 for the YBCO subsequently deposited. These results indicate that RE-doping may be suitable to improve the film quality with an ameliorated thickness.…”

Influence of Morphology and Texture of CeO2 on YBa2Cu3O7 (YBCO) Growth and BaCeO3 Formation in Solution‐Derived Synthesis

“…This mismatch can be influenced by use of metal substitution. [27,28] CSD methods allow for easy control of this metal substitution on an atomic scale. A further optimization of the surface morphology, on the other hand, will prove to be significantly harder, as the thermal synthesis process has already been fine-tuned.…”

Pulsed electron deposition (PED) of single buffer layer for ‘low-cost’ YBCO coated conductors

“…We have recently reported [3,4] ), the lattice mismatch vs. Ni alloy substrate is reduced, leading to a significant increase of the BL critical thickness up to 280 nm. In addition, the doping increases the material fracture toughness, as demonstrated by dielectric strength measurements.…”

“…Thick and crack-free single doped CeO 2 BL reported in ref. [3,4] have been deposited by thermal and e-gun evaporation; however, these deposition techniques do not seem to be suitable for long length processes, due to problems in maintaining stable deposition conditions over long terms, contamination of the vacuum chamber, difficult control of the stoichiometry transferred from the target to the substrate, limited deposition rate, etc. Pulsed Electron Deposition (PED) is a relatively new system that is attracting a great attention for its simplicity, reduced investment cost and flexibility.…”